Sayan Seal

Researcher

University of Arkansas

Also affiliated: Cree (China) (2018)

Faculty Researcher

7 h-index 20 pubs 271 cited

Research Areas

Links

ORCID

OverviewAI-generated summary

Sayan Seal's research focuses on the study of molecular biology techniques and applications. This includes investigating protein structure and dynamics, as well as exploring the mechanisms of cellular transport and secretion. Seal's work also extends to understanding receptor mechanisms and signaling pathways within biological systems. The research aims to elucidate fundamental processes at the molecular level.

Metrics

h-index: 7
Publications: 20
Citations: 271

Selected Publications

Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance (2020)

IEEE Journal of Emerging and Selected Topics in Power Electronics 17 citations DOI OpenAlex
A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver (2020)

IEEE Transactions on Power Electronics 10 citations DOI OpenAlex
Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET (2018)

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 1 citation DOI OpenAlex
3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging (2017)

3 citations DOI OpenAlex
Thermo-mechanical reliability analysis of flip-chip bonded silicon carbide Schottky diodes (2017)

8 citations DOI OpenAlex
High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions (2017)

Energies 95 citations DOI OpenAlex
Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding (2016)

23 citations DOI OpenAlex
Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules (2016)

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 3 citations DOI OpenAlex
The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer (2016)

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 4 citations DOI OpenAlex
Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications (2015)

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 3 citations DOI OpenAlex
Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices (2015)

3 citations DOI OpenAlex
Design of a reduced form factor passive heat sink for high power applications (2015)

6 citations DOI OpenAlex
Nanosilver preform assisted die attach for high temperature applications (2015)

7 citations DOI OpenAlex