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Listed
Presence
Current · Arkansas
Last published
2020
Sources
OpenAlex · ORCID
Refreshed
2026-10-07
S
Sayan Seal
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Also affiliated: Wolfspeed, Inc. (United States) (2017–2020)
7 h-index
20 pubs
284 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Sayan Seal's research focuses on the study of molecular biology techniques and applications. This includes investigating protein structure and dynamics, as well as exploring the mechanisms of cellular transport and secretion. Seal's work also extends to understanding receptor mechanisms and signaling pathways within biological systems. The research aims to elucidate fundamental processes at the molecular level.
Metrics
- h-index: 7
- Publications: 20
- Citations: 284
Selected Publications
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Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance (2020)
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A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver (2020)
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Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET (2018)
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3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging (2017)
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Thermo-mechanical reliability analysis of flip-chip bonded silicon carbide Schottky diodes (2017)
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High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions (2017)
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Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding (2016)
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Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules (2016)
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The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer (2016)
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Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications (2015)
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Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices (2015)
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Design of a reduced form factor passive heat sink for high power applications (2015)
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Nanosilver preform assisted die attach for high temperature applications (2015)
Collaboration Network
Top Collaborators
H. Alan Mantooth
University of Arkansas at Fayetteville
11 shared publications
In database
- High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions
- Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver
- Thermo-mechanical reliability analysis of flip-chip bonded silicon carbide Schottky diodes
Showing 5 of 11 shared publications
Michael D. Glover
University of Arkansas at Fayetteville
7 shared publications
In database
- Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding
- Nanosilver preform assisted die attach for high temperature applications
- Design of a reduced form factor passive heat sink for high power applications
- The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer
- Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices
Showing 5 of 7 shared publications
Andrea K. Wallace
Northrop Grumman (United States) (US)
6 shared publications
- Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver
- Thermo-mechanical reliability analysis of flip-chip bonded silicon carbide Schottky diodes
- 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
Showing 5 of 6 shared publications
Alan Mantooth
University of Arkansas at Fayetteville
2 shared publications
In database
- Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
John E. Zumbro
University of Arkansas at Fayetteville
2 shared publications
In database
- Thermo-mechanical reliability analysis of flip-chip bonded silicon carbide Schottky diodes
- 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
Mahsa Montazeri
University of Arkansas at Fayetteville
2 shared publications
In database
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
David Huitink
University of Arkansas at Fayetteville
2 shared publications
In database
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
Paul Croteau
Hartford Financial Services (United States)
1 shared publication
- Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications
Ryan Witherell
Hartford Financial Services (United States)
1 shared publication
- Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications
Shashank Krishnamurthy
Hartford Financial Services (United States)
1 shared publication
- Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications
Audrey Dearien
University of Arkansas at Fayetteville
1 shared publication
In database
- A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver
Chris Farnell
University of Arkansas at Fayetteville
1 shared publication
In database
- A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver
Hongwu Peng
University of Arkansas at Fayetteville (US)
1 shared publication
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
Fang Luo
Stony Brook University (US)
1 shared publication
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
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