S. Spiesshoefer

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University of Arkansas

6 h-index 11 pubs 295 cited

Research Areas

OverviewAI-generated summary

S. Spiesshoefer's research interests are documented through publications primarily from 2006. The researcher's work has focused on the study of plant physiology and cultivation, including investigations into plant stress responses and tolerance mechanisms. Spiesshoefer's research has also explored the cultivation and yield improvement of specific crops, such as rice, and has examined the impact of various agronomic practices on plant growth and productivity.

Metrics

h-index: 6
Publications: 11
Citations: 295

Selected Publications

Copper electroplating to fill blind vias for three-dimensional integration (2006)

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films 29 citations DOI OpenAlex
Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias (2005)

IEEE Transactions on Advanced Packaging 65 citations DOI OpenAlex
Process integration for through-silicon vias (2005)

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films 77 citations DOI OpenAlex
Control of sidewall slope in silicon vias using SF6∕O2 plasma etching in a conventional reactive ion etching tool (2005)

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena 46 citations DOI OpenAlex
Copper Electroplating for High Density 3D Through Silicon Via Interconnects (2004)

Pan Pacific Symposium DOI OpenAlex
IC stacking technology using fine pitch, nanoscale through silicon vias (2004)

32 citations DOI OpenAlex
Z-axis interconnects using fine pitch, nanoscale through-silicon vias: Process development (2004)

42 citations DOI OpenAlex
Alternative Z-axis connector technologies for high-density 3-D packaging (2003)

3 citations DOI OpenAlex