Match tier Likely match
Presence Formerly Arkansas
Last published 2024
Sources OpenAlex · ORCID
Refreshed 2026-08-16

Michael D. Glover

This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.

Research Assistant Professor

Formerly Arkansas Affiliated with University of Arkansas through 2017; recent publications list Dillon Consulting.

Faculty Researcher

13 h-index 38 pubs 963 cited

Biography and Research Information

OverviewAI-generated summary

Michael D. Glover is a Research Assistant Professor at the University of Arkansas at Fayetteville. His research focuses on the condition assessment of regional water distribution reservoirs. He has published work on this topic, with his most recent publication in 2024.

Metrics

  • h-index: 13
  • Publications: 38
  • Citations: 963

Selected Publications

  • 3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices (2017)
    IEEE Transactions on Power Electronics 75 citations DOI OpenAlex
  • A Solution to Press-Pack Packaging of SiC MOSFETS (2017)
    IEEE Transactions on Industrial Electronics 104 citations DOI OpenAlex
  • Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding (2016)
    23 citations DOI OpenAlex
  • Design and evaluation of press-pack SiC MOSFET (2016)
    10 citations DOI OpenAlex
  • Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules (2016)
    Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 3 citations DOI OpenAlex
  • The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer (2016)
    Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 4 citations DOI OpenAlex
  • A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits (2016)
    Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 3 citations DOI OpenAlex
  • Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications (2015)
    Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 3 citations DOI OpenAlex
  • Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices (2015)
    3 citations DOI OpenAlex
  • High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications (2015)
    IEEE Transactions on Components Packaging and Manufacturing Technology 27 citations DOI OpenAlex
  • Design of a reduced form factor passive heat sink for high power applications (2015)
    6 citations DOI OpenAlex
  • Nanosilver preform assisted die attach for high temperature applications (2015)
    7 citations DOI OpenAlex
  • Metal Layer Losses in Thin-Film Microstrip on LTCC (2014)
    IEEE Transactions on Components Packaging and Manufacturing Technology 11 citations DOI OpenAlex
  • Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems (2014)
    IEEE Journal of Emerging and Selected Topics in Power Electronics 261 citations DOI OpenAlex
  • Integrated Protection Circuits for an NMOS Silicon Carbide Gate Driver Integrated Circuit (2014)
    Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) 4 citations DOI OpenAlex

View all publications on OpenAlex →

Collaboration Network

3 Collaborators 2 Institutions 1 Country

Top Collaborators

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