Match tier
Likely match
Presence
Current · Arkansas
Last published
2017
Sources
OpenAlex · ORCID
Refreshed
2026-10-05
M
Michael D. Glover
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Research Assistant Professor
13 h-index
38 pubs
1,000 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Michael D. Glover is a Research Assistant Professor at the University of Arkansas at Fayetteville. His research focuses on the condition assessment of regional water distribution reservoirs. He has published work on this topic, with his most recent publication in 2024.
Metrics
- h-index: 13
- Publications: 38
- Citations: 1,000
Positions
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Research Assistant Professor 2013–presentUniversity of Arkansas Fayetteville Electrical Engineering / HiDEC ORCID
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Research Associate 1995–2013University of Arkansas Fayetteville Electrical Engineering / HiDEC ORCID
Selected Publications
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3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices (2017)
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A Solution to Press-Pack Packaging of SiC MOSFETS (2017)
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Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding (2016)
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Design and evaluation of press-pack SiC MOSFET (2016)
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Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules (2016)
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The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer (2016)
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A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits (2016)
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Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications (2015)
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Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices (2015)
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High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications (2015)
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Design of a reduced form factor passive heat sink for high power applications (2015)
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Nanosilver preform assisted die attach for high temperature applications (2015)
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Metal Layer Losses in Thin-Film Microstrip on LTCC (2014)
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Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems (2014)
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Integrated Protection Circuits for an NMOS Silicon Carbide Gate Driver Integrated Circuit (2014)
Collaboration Network
Top Collaborators
H. Alan Mantooth
University of Arkansas at Fayetteville
20 shared publications
In database
- Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems
- A Solution to Press-Pack Packaging of SiC MOSFETS
- 3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices
- Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles
- High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
Showing 5 of 20 shared publications
Sayan Seal
8 shared publications
In database
- 3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices
- Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding
- Nanosilver preform assisted die attach for high temperature applications
- Design of a reduced form factor passive heat sink for high power applications
- The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer
Showing 5 of 8 shared publications
Paul Shepherd
University of Arkansas at Fayetteville (US)
6 shared publications
- Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- A UVLO Circuit in SiC Compatible With Power MOSFET Integration
Showing 5 of 6 shared publications
Kaoru Porter
University of Arkansas at Fayetteville (US)
5 shared publications
- High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
- Metal Layer Losses in Thin-Film Microstrip on LTCC
- Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications
- A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic Technology
- Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
S.S. Frank
Oak Ridge National Laboratory (US)
5 shared publications
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- A UVLO Circuit in SiC Compatible With Power MOSFET Integration
- An integrated gate driver in 4H-SiC for power converter applications
Laura D. Marlino
Oak Ridge National Laboratory (US)
5 shared publications
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- A UVLO Circuit in SiC Compatible With Power MOSFET Integration
- An integrated gate driver in 4H-SiC for power converter applications
Ty McNutt
Arkansas Power Electronics International
5 shared publications
In database
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- A UVLO Circuit in SiC Compatible With Power MOSFET Integration
- An integrated gate driver in 4H-SiC for power converter applications
Bret Whitaker
Arkansas Power Electronics International (US)
5 shared publications
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- A UVLO Circuit in SiC Compatible With Power MOSFET Integration
- An integrated gate driver in 4H-SiC for power converter applications
Emmanuel Decrossas
University of Arkansas at Fayetteville
4 shared publications
In database
- High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
- Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications
- A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic Technology
- Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
Michael C. Hamilton
Auburn University (US)
4 shared publications
- High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
- Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications
- A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic Technology
- Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
L.W. Schaper
University of Arkansas at Fayetteville
4 shared publications
In database
- Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors
- Integration of Tantalum Pentoxide Capacitors With Through-Silicon Vias
- Miniaturizing power electronics using multi-chip module technology
- Alternative Z-axis connector technologies for high-density 3-D packaging
Alan Mantooth
University of Arkansas at Fayetteville
4 shared publications
In database
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications
Ranjan Lamichhane
University of Arkansas at Fayetteville (US)
4 shared publications
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- An integrated gate driver in 4H-SiC for power converter applications
Zach Cole
Arkansas Power Electronics International (US)
4 shared publications
- A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
- A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
- High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
- An integrated gate driver in 4H-SiC for power converter applications
Sang Won Yoon
Northwood University (US)
4 shared publications
- Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles
- Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles
- Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles
- Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power Electronics
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Based on overlapping research topics
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