Mohammad K. Chowdhury
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Research Areas
Biography and Research Information
OverviewAI-generated summary
Mohammad K. Chowdhury's research focuses on fabrication processes for electronic packaging, particularly for RF-MEMS and related microsystems. His work investigates the behavior of liquid crystal polymer (LCP) in direct laser-assisted bonding (DLAB) for wafer-level packaging. He also studies mechanically punched micro via fabrication processes in LCP substrates for these applications. Chowdhury has published two papers, with his most recent in 2026. His research has accumulated one citation and an h-index of 1.
Metrics
- h-index: 1
- Publications: 2
- Citations: 1
Selected Publications
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Understanding the Behavior of Liquid Crystal Polymer (LCP) in Direct Laser Assisted Bonding (DLAB) for Wafer-level Packaging of MEMS and Related Microsystems (2026)
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Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications (2026)
Collaboration Network
Top Collaborators
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
- Understanding the Behavior of Liquid Crystal Polymer (LCP) in Direct Laser Assisted Bonding (DLAB) for Wafer-level Packaging of MEMS and Related Microsystems
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