Ashok Saxena
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President
Also affiliated: Georgia Institute of Technology (1986–2023); Galgotias University (2013–2015); University of Arkansas System (2026); Hindustan Aeronautics Limited (India) (1980); University of Cincinnati (1973–1975); Banaras Hindu University (1980); Westinghouse Electric (United States) (1978–2009)
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
Ashok Saxena's research has focused on materials science, particularly in the areas of fracture mechanics, fatigue, and the properties of engineering materials. He has investigated crack growth in various specimens, contributing to the understanding of material behavior under stress. His work includes the development of models for fatigue crack propagation and the study of creep crack growth under non-steady-state conditions.
Saxena has also explored the characteristics of specific materials, including nanocrystalline materials stabilized with dopants and nickel-titanium instruments with applications in endodontics. His scholarship metrics include an h-index of 36, with 224 publications and over 5,000 citations, reflecting a substantial body of work in his field. He is noted as recently active in research.
Metrics
- h-index: 34
- Publications: 201
- Citations: 4,868
Positions
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President 2018–presentWireTough Cylinders. LLC ORCID
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President publications 2003–2026University of Arkansas at Fayetteville ORCID
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Distinguished Professor and Dean Emeritus 2017–2020University of Arkansas at Fayetteville Mechanical Engineering ORCID
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Provost and Distinguished Professor 2015–2016University of Arkansas Mechanical Engineering ORCID
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Vice-Chancellor 2012–2014Galgotias University ORCID
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Dean of Engineering 2003–2012University of Arkansas at Fayetteville College of Engineering ORCID
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Regents' Professor 2002–2003Georgia Institute of Technology School of Materials Science and Engineering ORCID
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Professor and Chair 1993–2002Georgia Institute of Technology School of Materials Science and Engineering ORCID
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Professor 1985–1993Georgia Institute of Technology School of Materials Science and Engineering ORCID
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Fellow Scientist (1984-85) Senior Engineer (1976-84) 1976–1985Westinghouse Research and Development Center Materials Science Division ORCID
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Research Metallurgist 1974–1976Nippon Steel R&D Center ORCID
Selected Publications
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Creep Crack Growth Under Transient and Steady-State Conditions in Creep- Brittle Alloy 718 (2026)
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Thermal Stress Analysis in a Multilayer Power Module (2026)
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Effects of Hold Time on the Elevated Temperature Fatigue Crack Growth Behavior of Alloy 247LC‐DS (2026)
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Creep crack growth in alloy 247LC‐DS (2024)
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A Phenomenological Model for Creep and Creep-Fatigue Crack Growth Rate Behavior in Ferritic Steels (2023)
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A Phenomenological Model for Creep and Creep-fatigue Crack Growth Behavior in Ferritic Steels (2023)
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Evolution of Creep Deformation near Tips of Sharp Notches and Cracks in CM247LC-DS Ni-Base Superalloy (2023)
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Thermomechanical Fatigue—Mechanisms and Practical Life Analysis (2021)
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Modelling the crack growth behaviour of a single crystal nickel base superalloy under TMF loading with long dwell times (2020)
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Results of the ASTM Round Robin on Creep-Fatigue Crack Growth Testing of a P91 Steel (2019)
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Challenges in predicting crack growth in structures operating in extreme environments (2019)
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Accounting for crack tip cyclic plasticity and creep reversal in estimating (Ct)avg during creep‐fatigue crack growth (2019)
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Advanced Fracture Mechanics and Structural Integrity (2019)
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Fracture control and structural integrity (FraCSI) education and research (2018)
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Fatigue Crack Growth Behaviour of High Strength Ferritic Steels in High Pressure Hydrogen (2018)
Collaboration Network
Top Collaborators
- Crack growth behavior of 9Cr−1Mo (P91) steel under creep–fatigue conditions
- A double edge notch specimen design for tension–compression fatigue crack growth testing
- ASTM Round-Robin on Creep-Fatigue and Creep Behavior of P91 Steel
- Round robin on creep fatigue crack growth testing for verification of ASTM standard 2760-10
- Accounting for crack tip cyclic plasticity and creep reversal in estimating (Ct)avg during creep‐fatigue crack growth
Showing 5 of 11 shared publications
- Microstructural stability of copper with antimony dopants at grain boundaries: experiments and molecular dynamics simulations
- Plastic deformation of nanocrystalline copper-antimony alloys
- Heterogeneous dislocation nucleation in single crystal copper–antimony solid-solution alloys
- Microstructure stability of nanocrystalline materials using dopants
- Molecular Dynamics Simulations of Dislocation Activity in Single-Crystal and Nanocrystalline Copper Doped with Antimony
Showing 5 of 8 shared publications
- Nonlinear constitutive models from nanoindentation tests using artificial neural networks
- Nanoindentation of single crystal and polycrystalline copper nanowires
- Nanocrystalline copper and nickel as ultra high-density chip-to-package interconnections
- Material characterization for nano wafer level packaging application
- Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation
Showing 5 of 7 shared publications
- Microstructural stability of copper with antimony dopants at grain boundaries: experiments and molecular dynamics simulations
- Plastic deformation of nanocrystalline copper-antimony alloys
- Heterogeneous dislocation nucleation in single crystal copper–antimony solid-solution alloys
- Microstructure stability of nanocrystalline materials using dopants
- Molecular Dynamics Simulations of Dislocation Activity in Single-Crystal and Nanocrystalline Copper Doped with Antimony
Showing 5 of 7 shared publications
- Stabilizing nanocrystalline materials with dopants
- Molecular dynamics simulations of grain size stabilization in nanocrystalline materials by addition of dopants
- Atomistic simulation of grain boundary energetics – Effects of dopants
- Improving grain boundary sliding resistance with segregated dopants
- Molecular Dynamics Study of Grain Growth in Nanocrystalline Materials in the Presence of Dopants
Showing 5 of 6 shared publications
- Stabilizing nanocrystalline materials with dopants
- Molecular dynamics simulations of grain size stabilization in nanocrystalline materials by addition of dopants
- Atomistic simulation of grain boundary energetics – Effects of dopants
- Improving grain boundary sliding resistance with segregated dopants
- Molecular Dynamics Study of Grain Growth in Nanocrystalline Materials in the Presence of Dopants
Showing 5 of 6 shared publications
- Microstructure stability of nanocrystalline materials using dopants
- Material characterization for nano wafer level packaging application
- Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation
- Low cycle fatigue crack growth in nanostructure copper
- A numerical analysis of crack growth and morphology evolution in chip-to-packages nano-interconnections
- Atomistic simulation of grain boundary energetics – Effects of dopants
- Nanoindentation of single crystal and polycrystalline copper nanowires
- Nanocrystalline copper and nickel as ultra high-density chip-to-package interconnections
- Design of Nanocrystalline Materials for Structural Applications
- ASTM Round-Robin on Creep-Fatigue and Creep Behavior of P91 Steel
- Prognostics of high temperature component reliability
- A Recent Development in Creep-Fatigue Testing
- WITHDRAWN: Dislocation-based constitutive modeling of martensitic/ferritic steels at elevated temperatures. Part II: Cyclic behavior without hold time effects
- Creep deformation and rupture behaviour of directionally solidified GTD 111 superalloy
- Modeling of creep crack growth and fracture toughness behaviour of directionally solidified GTD 111 superalloy
- Creep Resistance in Nonferritic Metals
- Creep Resistance in Nonferritic Metals
- Low cycle fatigue in rene 88DT at 650 °C: Crack nucleation mechanisms and modeling
- A critical assessment of fatigue crack nucleation and growth models for Ni- and Ni,Fe-based superalloys
- J-integral expressions for semi-elliptical cracks in round bars
- A critical assessment of fatigue crack nucleation and growth models for Ni- and Ni,Fe-based superalloys
- Elevated Temperature Fatigue Crack Growth rate model for NI-BASE Superalloys
- Modeling Creep Fatigue
- Elevated temperature fatigue crack growth model for DS-GTD-111
- Creep crack growth data reduction of directionally solidified Ni base superalloy usingCtestimation scheme for anisotropic materials
- Oxide-scale thickness measurement for predicting crack growth history in elevated temperature components
- Applications of fracture mechanics in assessing integrity of hydrogen storage systems
- On single-edge-crack tension specimens for tension-compression fatigue crack growth testing
- Fatigue Crack Growth Behaviour of High Strength Ferritic Steels in High Pressure Hydrogen
- Creep crack growth in alloy 247LC‐DS
- Evolution of Creep Deformation near Tips of Sharp Notches and Cracks in CM247LC-DS Ni-Base Superalloy
- Effects of Hold Time on the Elevated Temperature Fatigue Crack Growth Behavior of Alloy 247LC‐DS
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