L.W. Schaper

Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.

professor of electrical engineering at the University

University of Arkansas

Also affiliated: New Jersey Institute of Technology (1972); AT&T (United States) (1984); Alcoa (United States) (1992); Fayetteville Public Library (2002)

Faculty Researcher

18 h-index 93 pubs 925 cited

Research Areas

Links

ORCID Lab Website Research Group

OverviewAI-generated summary

L.W. Schaper is a professor of electrical engineering at the University of Arkansas at Fayetteville. His research has focused on semiconductor materials and devices, as well as advancements in semiconductor devices and circuit design. Schaper's work has contributed to the understanding and development within the field of electrical engineering.

Metrics

h-index: 18
Publications: 93
Citations: 925

Selected Publications

Alternative Processing Methods for Copper Through Silicon Vias (2026)

IMAPSource Proceedings DOI OpenAlex
New Niobium Pentoxide (Nb2O5) Integrated Capacitors for Decoupling Applications (2026)

IMAPSource Proceedings DOI OpenAlex
Integration of Tantalum Pentoxide Capacitors With Through-Silicon Vias (2011)

IEEE Transactions on Components Packaging and Manufacturing Technology 7 citations DOI OpenAlex
Reliability study of through-silicon via (TSV) copper filled interconnects (2009)

Thin Solid Films 49 citations DOI OpenAlex
Integrated Capacitors with Nb<sub>2</sub>O<sub>5</sub> Dielectric for Decoupling Applications (2009)

MRS Proceedings 1 citation DOI OpenAlex
3D-SiP: The latest miniaturization technology (2008)

2 citations DOI OpenAlex
Integrated system development for 3-D VLSI (2008)

4 citations DOI OpenAlex
Fabrication and testing of through-silicon vias used in three-dimensional integration (2008)

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena 29 citations DOI OpenAlex
Interconnect Process at the University of Arkansas (2008)

DOI OpenAlex
Dual Process Dielectric Formation for Decoupling Capacitors on Flexible Substrates (2007)

IEEE Transactions on Components and Packaging Technologies 4 citations DOI OpenAlex
Effect of process parameters on via formation in Si using deep reactive ion etching (2007)

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena 34 citations DOI OpenAlex
Integrated System Development for 3-D VLSI (2007)

7 citations DOI OpenAlex
High Density Double and Triple Layer Tantalum Pentoxide Decoupling Capacitors (2007)

IEEE Transactions on Components and Packaging Technologies 5 citations DOI OpenAlex
Effect of via profile on copper seed layer deposition for electroplating (2007)

7 citations DOI OpenAlex
Finite Element Analysis of Power Dissipation and Stress in 3-D Stack-Up Geometries (2007)

3 citations DOI OpenAlex