Ranjith Samuel E. John
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Role not yet determined Is this you? Add your title
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Ranjith John's research focuses on nanoparticle-based integrated passives. He is affiliated with the University of Arkansas at Fayetteville. His recent publication in 2021, "Introduction to Nanoparticle-Based Integrated Passives," highlights his engagement in this area of study.
Metrics
- h-index: 5
- Publications: 16
- Citations: 87
Selected Publications
-
Introduction to Nanoparticle-Based Integrated Passives (2021)
-
Experimental Study of Superconducting Electronic Multichip Modules Packaged Using Carbon Nanotube (CNT) Based Polymer Underfill (2013)
-
Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler (2011)
-
Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics (2010)
-
Carbon Nanotube Based Polymer Adhesive as an Underfill for Superconductor Multi-Chip Module Packaging (2010)
-
Introduction to Nanoparticle-Based Integrated Passives (2009)
Collaboration Network
Top Collaborators
- Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics
- Carbon Nanotube Based Polymer Adhesive as an Underfill for Superconductor Multi-Chip Module Packaging
- Experimental Study of Superconducting Electronic Multichip Modules Packaged Using Carbon Nanotube (CNT) Based Polymer Underfill
- Introduction to Nanoparticle-Based Integrated Passives
- Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler
Showing 5 of 6 shared publications
- Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics
- Carbon Nanotube Based Polymer Adhesive as an Underfill for Superconductor Multi-Chip Module Packaging
- Experimental Study of Superconducting Electronic Multichip Modules Packaged Using Carbon Nanotube (CNT) Based Polymer Underfill
- Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler
- Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics
- Carbon Nanotube Based Polymer Adhesive as an Underfill for Superconductor Multi-Chip Module Packaging
- Experimental Study of Superconducting Electronic Multichip Modules Packaged Using Carbon Nanotube (CNT) Based Polymer Underfill
- Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler
- Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics
- Carbon Nanotube Based Polymer Adhesive as an Underfill for Superconductor Multi-Chip Module Packaging
- Carbon Nanotube Based Polymer Adhesive as an Underfill for Superconductor Multi-Chip Module Packaging
- Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics
Similar Researchers
Based on overlapping research topics