Tong Su Source Confirmed

Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.

Researcher

John Brown University

faculty

4 h-index 16 pubs 51 cited

Research Areas

Links

ORCID

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OverviewAI-generated summary

Dr. Tong Su's research focuses on the mechanics of metals and thin films, with applications ranging from high-temperature coatings to semiconductor devices. His work encompasses both experimental and computational approaches to understanding stress and microstructure in materials such as transition metal nitrides and tungsten films. Recent studies have explored the impact of processing conditions on residual stress in sputtered films, along with the development of computational tools for stress analysis. Su's investigations also extend to diamond and carbon-based materials, copper interconnect reliability, and, more recently, environment-friendly capacitive deionization strategies for rare-earth ion recovery using nickel foam.

Metrics

h-index: 4
Publications: 16
Citations: 51

Selected Publications

Model for Thin Film Stress During the Early Stage of Island Coalescence (2025) DOI
Analysis of Stress in Sputter-Deposited Films Using a Kinetic Model for Cu, Ni, Co, Cr, Mo, W (2022) DOI
Inter-Relationship of Stress and Microstructure in BCC and 'Beta' Tungsten Films (2022) DOI
Analysis of Stress in Sputter-Deposited Films Using a Kinetic Model for Cu, Ni, Co, Cr, Mo, W (2022) DOI