Match tier Confirmed
Presence Current · Arkansas
Last published 2026
Sources OpenAlex · ORCID
Refreshed 2026-10-05

Emmanuel Decrossas

Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.

RF/microwave Engineer

Also affiliated: California Institute of Technology (2013–2024); Jet Propulsion Laboratory (2013–2025)

13 h-index 66 pubs 556 cited

Biography and Research Information

OverviewAI-generated summary

Emmanuel Decrossas is an RF/microwave engineer whose research interests include the development and application of antennas and radio frequency components for various missions. His work has involved the evaluation of technologies such as 3D printing for antenna manufacturing and the design of components for high-frequency radar systems. Decrossas has contributed to publications on topics including advanced CubeSat antennas, submillimeter-wave phase shifters, and terahertz antenna arrays. He has also investigated the characterization of materials like carbon nanotubes for RF applications.

His research has seen him collaborate with other researchers at the University of Arkansas at Fayetteville, including Samir El-Ghazaly, Cory L. Butts, and Roberto Quezada. Decrossas's scholarly output includes 66 publications, with an h-index of 13 and over 550 citations. His recent work includes contributions to the REASON radar mission for Europa.

Metrics

  • h-index: 13
  • Publications: 66
  • Citations: 556

Positions

  • RF/microwave Engineer
    NASA Jet Propulsion Laboratory ORCID
  • RF/microwave Engineer publications 2010–2026
    University of Arkansas at Fayetteville ORCID

Selected Publications

  • Micro-Faraday Cage within Low-Temperature Co-fired Ceramic Board: Fabrication and Measurement (2026)
    IMAPSource Proceedings DOI OpenAlex
  • Lessons Learned to Transfer a K Band Radar System Designed on a Printed Circuit Board to a Low Temperature Co-Fired Ceramic Board (2026)
    IMAPSource Proceedings DOI OpenAlex
  • High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications (2015)
    IEEE Transactions on Components Packaging and Manufacturing Technology 29 citations DOI OpenAlex
  • Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques (2013)
    Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) DOI OpenAlex
  • A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic Technology (2013)
    IMAPSource Proceedings DOI OpenAlex

View all publications on OpenAlex →

Collaboration Network

21 Collaborators 6 Institutions 2 Countries

Top Collaborators

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