H. Alan Mantooth
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Distinguished Professor of Electrical Engineering
Also affiliated: Analog Devices (United States) (1993–2003); Georgia Institute of Technology (2002–2003); National Institute of Standards and Technology (1997); University of Arkansas System (2025); Institute of Electrical and Electronics Engineers (2007); Fayetteville Public Library (2013); Arkansas Power Electronics International (2005–2013); Auburn University (2011); Aalborg University (2022)
Faculty Researcher
Research Areas
Biomedical Subjects
Biography and Research Information
OverviewAI-generated summary
H. Alan Mantooth is a Distinguished Professor in Electrical Engineering at the University of Arkansas at Fayetteville, focusing his research on power electronics and cyber-physical systems. His work investigates the security and resilience of these systems, particularly in the context of photovoltaic (PV) energy generation and smart inverters. Mantooth has explored challenges and solutions related to the parallel connection of silicon carbide MOSFETs and the design of efficient inverters utilizing hybrid silicon and silicon carbide switches.
His research extends to the architectural design and system compatibility of power modules, impacting the overall performance of power electronics systems. Mantooth also leads a research group and maintains an active lab website, contributing to the advancement of power system technologies. He has secured federal funding, serving as Co-PI on grants from the National Science Foundation (NSF) totaling over $600,000 for projects related to communication systems, microwave technologies, and the trustworthiness of energy systems.
Mantooth is recognized as a highly cited researcher with an h-index of 47 and over 525 publications. His collaborations within the University of Arkansas include extensive work with Md Maksudul Hossain, Kevin Chen, Dereje Woldegiorgis, and Zhong Chen.
Metrics
- h-index: 47
- Publications: 525
- Citations: 9,525
Selected Publications
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Dual-channel 2DEG micro-Hall effect sensor for extreme environments (2026)
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Trade-off between Hall sensitivity, temperature stability, and frequency response in a 2DEG nitride Hall-effect sensor (2026)
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Artificial Intelligence for Design Optimization of High Frequency Power Electronics Converters (2025)
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Microgrid Controller Validation via High-Power Alpha Testing Wesley G. Schwartz (2025)
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LAREL: A Reliability-Aware Framework for Power Module Layout Optimization Under Dynamic Drive Cycle Stress (2025)
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A Dynamic Waveform Analysis Methodology in a FPGA Embedded Digital Twin for Secure ANPC Inverter Firmware Validation (2025)
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Parametric Analysis of an AlScN Based Ferroelectric Capacitor Model in a Ferroelectric Memory Bitcell (2025)
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SEU Effect in E-Mode β-Ga <sub>2</sub> О <sub>3</sub> MOSFET with Epitaxial Drift Layer at the Breakdown Region (2025)
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Fabrication and Characterization of 4H-SiC Schottky Barrier Diodes with Highly Linear Temperature Sensitivity (2025)
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A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules (2025)
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TCAD-Aided Investigation of Temperature-Dependent Behavior in 4H-SiC P-Channel MOSFETs Up to 500°C (2025)
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Design and Evaluation of a 650 V, 300 A GaN-Based Power Module with Integrated Drivers and Ultra-Low Inductance Layout (2025)
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Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability (2025)
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A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters (2024)
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A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution (2024)
ARA Academy 2015 ARA Fellow
Dr. Mantooth has established an internationally recognized electronics research program at the University of Arkansas. His team's designs have been deployed on the International Space Station, enduring extreme temperatures and radiation exposure. He has founded and supported three Arkansas-based startup companies, translating research into commercial applications. His economic contributions to the state are estimated to exceed $4 billion.
Policy Impact
Founded three Arkansas-based startup companies with estimated $4B+ economic impact. Designs deployed on the International Space Station.
Growth Areas
['Power Electronics, Advanced Packaging & Grid Management Systems']
Federal Grants 4 $18,499,758 total
Mid-Scale RI-1 (M1:IP): Implementation of a National Silicon Carbide Research Fabrication Facility
Travel: USA-AFRICA WORKSHOP ON COMMUNICATION SYSTEMS AND MICROWAVE TECHNOLOGIES
Conference: USA-Africa Workshop on Communications and Microwave Emerging Technologies
Collaboration Network
Top Collaborators
- A High Efficiency and Low Cost ANPC Inverter Using Hybrid Si/SiC Switches
- Analysis and Control of Cascaded Energy Storage System for Energy Efficiency and Power Quality Improvement in Electrified Railways
- Hybrid Control Strategy for LLC Converter With Reduced Switching Frequency Range and Circulating Current for Hold-Up Time Operation
- Simple and Effective Adaptive Deadtime Strategies for <i>LLC</i> Resonant Converter: Analysis, Design, and Implementation
- Digital Close-Loop Active Gate Driver for Static and Dynamic Current Sharing of Paralleled SiC MOSFETs
Showing 5 of 40 shared publications
- Datasheet-Driven Compact Model of Silicon Carbide Power MOSFET Including Third-Quadrant Behavior
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- Computational Efficiency Analysis of SiC MOSFET Models in SPICE: Dynamic Behavior
- Hybrid Si/SiC Switches: A Review of Control Objectives, Gate Driving Approaches and Packaging Solutions
- Comparisons and Evaluations of Silicon and Wide Band Gap Devices at Cryogenic Temperature
Showing 5 of 18 shared publications
- A Review of Current Research Trends in Power-Electronic Innovations in Cyber–Physical Systems
- Analysis and Control of Cascaded Energy Storage System for Energy Efficiency and Power Quality Improvement in Electrified Railways
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- Electrothermal-Control Co-Design of an All Silicon Carbide 2×250 kW Dual Inverter for Heavy-Duty Traction Applications
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
Showing 5 of 11 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- A Tutorial on High-Density Power Module Packaging
Showing 5 of 10 shared publications
- A High Efficiency and Low Cost ANPC Inverter Using Hybrid Si/SiC Switches
- Hybrid Si/SiC Switches: A Review of Control Objectives, Gate Driving Approaches and Packaging Solutions
- Precise Electro-thermal Power Loss Model of a Three-level ANPC Inverter with Hybrid Si/SiC Switches
- Application of An Active Gate Driver for Paralleling Operation of Si IGBT and SiC MOSFET
- Four Control Freedoms AGD for Hybrid SiC MOSFET and Si IGBT Application
Showing 5 of 9 shared publications
- Digital Close-Loop Active Gate Driver for Static and Dynamic Current Sharing of Paralleled SiC MOSFETs
- Digital Active Gate Driving System for Paralleled SiC MOSFETs with Closed-loop Current Balancing Control
- A Four-level Active Gate Driver with Continuously Adjustable Intermediate Gate Voltages
- Multi-level Active Gate Driver for SiC MOSFETs with Paralleling Operation
- Application of An Active Gate Driver for Paralleling Operation of Si IGBT and SiC MOSFET
Showing 5 of 8 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
Showing 5 of 8 shared publications
- Datasheet-Driven Compact Model of Silicon Carbide Power MOSFET Including Third-Quadrant Behavior
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- An Efficient Electro-Thermal Compact Model of SiC Power MOSFETs Including Third Quadrant Behavior
- Compact Modeling of High-Voltage Gallium Nitride Power Semiconductor Devices for Advanced Power Electronics Design
- Cryogenic Characterization and Modeling of Silicon IGBT for Hybrid Aircraft Application
Showing 5 of 7 shared publications
- Digital Close-Loop Active Gate Driver for Static and Dynamic Current Sharing of Paralleled SiC MOSFETs
- Digital Active Gate Driving System for Paralleled SiC MOSFETs with Closed-loop Current Balancing Control
- A Four-level Active Gate Driver with Continuously Adjustable Intermediate Gate Voltages
- Multi-level Active Gate Driver for SiC MOSFETs with Paralleling Operation
- 3.3 kV Low-Inductance Full SiC Power Module
Showing 5 of 7 shared publications
- Modular Expandable Multiinput Multioutput (MIMO) High Step-Up Transformerless DC–DC Converter
- High-Frequency Three-Port DC–DC Converter With Zero-Voltage Switching Operation
- Hybrid Si/SiC Switches: A Review of Control Objectives, Gate Driving Approaches and Packaging Solutions
- Digital Active Gate Driving System for Paralleled SiC MOSFETs with Closed-loop Current Balancing Control
- A Three-Port Non-Isolated High Voltage Conversion Ratio DC-DC Converter For MPPT Extraction Of Photovoltaic Systems
Showing 5 of 7 shared publications
- Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- 3.3 kV Low-Inductance Full SiC Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- High-Temperature (250°C) SiC Power Module Integrated with LTCC-Based Isolated Gate Driver
Showing 5 of 7 shared publications
- A review of silicon carbide CMOS technology for harsh environments
- High-temperature analysis of optical coupling using AlGaAs/GaAs LEDs for high-density integrated power modules
- Development of LTCC-packaged optocouplers as optical galvanic isolation for high-temperature applications
- Area-Efficient Silicon Carbide SCR Device for On-Chip ESD Protection
- High-Temperature (250°C) SiC Power Module Integrated with LTCC-Based Isolated Gate Driver
Showing 5 of 6 shared publications
- A review of silicon carbide CMOS technology for harsh environments
- A Tutorial on High-Density Power Module Packaging
- Development of LTCC-packaged optocouplers as optical galvanic isolation for high-temperature applications
- Area-Efficient Silicon Carbide SCR Device for On-Chip ESD Protection
- High-Temperature (250°C) SiC Power Module Integrated with LTCC-Based Isolated Gate Driver
Showing 5 of 6 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- 3.3 kV Low-Inductance Full SiC Power Module
- Development of a Hybrid Capillary-Driven Single-Phase and Two-Phase Micro-Cooler for Power Electronics Cooling
Showing 5 of 6 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- 3.3 kV Low-Inductance Full SiC Power Module
- A Double-Sided Cooled Power Module With Embedded Decoupling Capacitors
Showing 5 of 6 shared publications
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