Research Areas
Biography and Research Information
OverviewAI-generated summary
Matthew Norris's research focuses on the reliability and performance of solder joints under combined stress conditions, particularly in high-temperature environments. His work investigates methodologies for predicting solder fatigue reliability and developing high-temperature packaging schemes for power electronics. Norris has co-authored publications on topics such as non-traditional delivery of hands-on manufacturing courses and the sequential versus concurrent effects in solder joint reliability. His collaborators include David Huitink, Ekene Gabriel Okafor, Andrew Leda, and Collin Ruby, all from the University of Arkansas at Fayetteville.
Metrics
- Publications: 2
Selected Publications
-
A High Temperature LTCC Based Packaging Scheme for Power Electronics (2025)
-
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability (2024)
-
Quick Turn Methodology for High Temperature Solder Fatigue Reliability (2023)
Collaboration Network
Top Collaborators
- Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
- Quick Turn Methodology for High Temperature Solder Fatigue Reliability
- A High Temperature LTCC Based Packaging Scheme for Power Electronics
- Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
- Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
- Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
Similar Researchers
Based on overlapping research topics