D
David Huitink Data-verified
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
High Impact
Associate Professor
faculty
20 h-index
171 pubs
1,401 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
David Huitink's research has focused on several areas, including the development of drug delivery systems, specifically investigating the transdermal administration of medications. His work has involved studies using chitosan and meloxicam, with a particular emphasis on cutaneous application methods in animal models, including cattle. This includes research into the use of needles for drug delivery and the effectiveness of transdermal patches.
Huitink also contributes to research in power electronics, with publications addressing failure mechanisms and reliability models for power electronic devices. His work in this field includes the design and optimization of gate driver integrated multichip 3-D GaN power modules, as well as packaging tutorials for high-density power modules. He has also explored the optimization of laminated busbars for specific applications and investigates the properties of phase change materials, such as paraffin/silica and paraffin-based titania encapsulated materials synthesized via sol-gel methods.
His research network includes collaborators such as Muhammad Ghufran, Alexis Krone, Yarui Peng, and Reece Whitt, all from the University of Arkansas at Fayetteville, with whom he has co-authored multiple publications. Huitink holds a h-index of 20, with 171 total publications and 1,374 total citations, and has been recognized as a highly cited researcher.
Metrics
- h-index: 20
- Publications: 171
- Citations: 1,401
Selected Publications
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Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic Systems (2026)
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Modified tumor uptake and biodistribution of nanoparticles coated with small extracellular vesicle membranes derived from distinct tumor cell lines (2026)
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Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL Tool (2025)
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Advances in encapsulated phase change materials for integration in thermal management applications (2025)
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Cellulose–Starch Composite Aerogels as Thermal Superinsulating Materials (2024)
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability (2024)
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Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices (2024)
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Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
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Altering Electromigration Response in Aluminum Wire Bonds through Heat Treatment (2024)
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Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation (2024)
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Effect of temperature on the stability and performance of III-nitride HEMT magnetic field sensors (2024)
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Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints (2024)
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Transient Liquid Phase Bond Acceleration Using Copper Nanowires (2024)
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Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics (2024)
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Synthesis of silica-encapsulated myristic acid phase-change-assisted nanocapsules for thermal management applications (2024)
Collaboration Network
Top Collaborators
John Harris
University of Arkansas at Fayetteville (US)
9 shared publications
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Thermal stability study of gallium nitride based magnetic field sensor
- Laminated transient liquid phase preform and bond characterization for high-temperature power electronics application
Showing 5 of 9 shared publications
Whit Vinson
University of Arkansas at Fayetteville (US)
8 shared publications
- Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
- Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization
- Mechanical stress state consideration for enhanced electromigration life prediction in aluminum wire bonds
- Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
Showing 5 of 8 shared publications
Hayden Carlton
University of Arkansas at Fayetteville (US)
7 shared publications
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- Effect of Cu nanoparticles on the tribological performance of polydopamine + polytetrafluoroethylene coatings in oil-lubricated condition
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Controlled shape memory effects of magnetic polymer nanocomposites by induction heating
Showing 5 of 7 shared publications
H. Alan Mantooth
University of Arkansas at Fayetteville
7 shared publications
In database
- A Tutorial on High-Density Power Module Packaging
- Thermal stability study of gallium nitride based magnetic field sensor
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- A Partial Discharge Inception Voltage Modeling Approach
- Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth
Showing 5 of 7 shared publications
Muhammad Ghufran
University of Arkansas at Fayetteville
6 shared publications
In database
- Synthesis of nano-size paraffin/silica-based encapsulated phase change materials of high encapsulation ratio via sol–gel method
- Synthesis and thermal performance of nano-sized paraffin-based titania encapsulated PCMs via sol–gel method
- Synthesis of silica-encapsulated myristic acid phase-change-assisted nanocapsules for thermal management applications
- Advances in encapsulated phase change materials for integration in thermal management applications
- Synthesis of ePCMs for thermal management of electronics
Showing 5 of 6 shared publications
Asif Imran Emon
Stony Brook University (US)
5 shared publications
- Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
Alexis Krone
University of Arkansas at Fayetteville
5 shared publications
In database
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Thermal stability study of gallium nitride based magnetic field sensor
- High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
Fang Luo
Stony Brook University (US)
5 shared publications
- Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
Reece Whitt
University of Arkansas at Fayetteville
5 shared publications
In database
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
- Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
- Thermal Management Performance of an Additively Manufactured Jet Impingement Cooler for Power Electronics
- Converging Jet Impingement for Enhanced Liquid Cooling
- Dual Converging Jets for Enhanced Liquid Impingement Cooling
Mustafeez Ul Hassan
Stony Brook University (US)
4 shared publications
- Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
Zhao Yuan
University of Arkansas at Fayetteville (US)
4 shared publications
- Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
Yarui Peng
University of Arkansas at Fayetteville
4 shared publications
In database
- PowerSynth-Guided Reliability Optimization of Multi-Chip Power Module
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
- Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Nenad Miljkovic
University of Illinois Urbana-Champaign (US)
4 shared publications
- Direct cooling of a planar magnetic converter using dielectric liquid forced convection enabled by additive manufacturing
- Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
- HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
- Direct Cooling of a Planar Magnetic Converter Using Dielectric Liquid Forced Convection Enabled by Additive Manufacturing
Abdul Basit Mirza
Stony Brook University (US)
3 shared publications
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
Imam Al Razi
University of Arkansas at Fayetteville
3 shared publications
In database
- PowerSynth-Guided Reliability Optimization of Multi-Chip Power Module
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
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