David Huitink Source Confirmed

Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.

High Impact

Associate Professor

University of Arkansas at Fayetteville

faculty

20 h-index 170 pubs 1,343 cited

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Biography and Research Information

OverviewAI-generated summary

David Huitink's research focuses on the reliability and packaging of power electronic devices, particularly those utilizing wide-bandgap semiconductors like Gallium Nitride (GaN). He has investigated advanced packaging techniques, including gate driver integration and wire-bondless multichip modules, to enhance the performance and density of power systems. His work also extends to understanding and modeling failure mechanisms that impact the long-term reliability of these components.

Huitink's publications include a review on failure mechanisms driving reliability models for power electronics and studies on optimizing insulation and switching performance for demanding applications such as more-electric aircraft. He has also explored the synthesis and thermal performance of phase change materials (PCMs) encapsulated with nano-sized silica and titania, as well as the tribological effects of nanoparticle coatings on material performance under lubrication.

With a substantial publication record of 170 papers and an h-index of 20, Huitink is recognized as a highly cited researcher. He actively collaborates with colleagues at the University of Arkansas at Fayetteville, including Muhammad Ghufran, Alexis Krone, Yarui Peng, and Reece Whitt, on shared research endeavors.

Metrics

  • h-index: 20
  • Publications: 170
  • Citations: 1,343

Selected Publications

  • Advances in encapsulated phase change materials for integration in thermal management applications (2025) DOI
  • Cellulose–Starch Composite Aerogels as Thermal Superinsulating Materials (2024) DOI
  • Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability (2024) DOI
  • Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices (2024) DOI
  • Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024) DOI
  • Altering Electromigration Response in Aluminum Wire Bonds through Heat Treatment (2024) DOI
  • Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation (2024) DOI
  • Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints (2024) DOI
  • Transient Liquid Phase Bond Acceleration Using Copper Nanowires (2024) DOI
  • Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics (2024) DOI
  • Synthesis of silica-encapsulated myristic acid phase-change-assisted nanocapsules for thermal management applications (2024) DOI
  • Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024) DOI
  • Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth (2023) DOI
  • Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules (2023) DOI
  • Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions (2023) DOI

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