Ajay P. Malshe
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Researcher
Also affiliated: ON Semiconductor (United States) (2001); Australian National University (2005); Caterpillar (United States) (2010); Solid State Physics Laboratory (1993); Purdue University West Lafayette (2020–2026); University of Arkansas System (2010–2019); VinTech (United States) (2005–2013); Centre of Advanced Studies (1992); The Ohio State University (1993–1994); Coherent (United States) (2001); Savitribai Phule Pune University (1987–1999)
Faculty Researcher
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Ajay P. Malshe's research activities are centered on materials science, with a focus on semiconductor materials and devices. His work investigates advancements in semiconductor devices and circuit design, contributing to the field through study and publication. Malshe's research network includes collaborations with other researchers, further enhancing the scope and impact of his investigations.
Metrics
- h-index: 40
- Publications: 242
- Citations: 5,979
Selected Publications
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Nano Electro-Machining (nano-EM): A Novel Method for Sculpting Nano Vias (< 20 nm) for Nanoscale Packaging (2026)
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Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications (2026)
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Introduction to Nanoparticle-Based Integrated Passives (2021)
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Exploring Convergence of Snake-Skin-Inspired Texture Designs and Additive Manufacturing for Mechanical Traction (2019)
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Bio-inspired textures for functional applications (2018)
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Understanding evolution of tribo-chemical interfaces during boundary lubrication in manufacturing (2017)
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MEMS and MOEMS Packaging (2017)
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Investigation of hydrodynamic arc breaking mechanism in blasting erosion arc machining (2016)
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A Comparative Study on Machining Capabilities of Wet and Dry Nano-scale Electro-machining (2016)
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Micro additive manufacturing using ultra short laser pulses (2015)
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Energy Demand Analysis of Photovoltaic Device – Material and Nanomanufacturing Process Discovery (2015)
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Ultrasonic machining of biomass using biodegradable slurry (2014)
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Single-spark analysis of removal phenomenon in magnetic field assisted dry EDM (2013)
Collaboration Network
Top Collaborators
- Introduction to Nanoparticle-Based Integrated Passives
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
- Nano Electro-Machining (nano-EM): A Novel Method for Sculpting Nano Vias (< 20 nm) for Nanoscale Packaging
- Nano Electro-Machining (nano-EM): A Novel Method for Sculpting Nano Vias (< 20 nm) for Nanoscale Packaging
- Nano Electro-Machining (nano-EM): A Novel Method for Sculpting Nano Vias (< 20 nm) for Nanoscale Packaging
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