L.W. Schaper
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OverviewAI-generated summary
L.W. Schaper's research has focused on the integration of electronic components within flexible substrates, particularly polyimide films. Publications detail the development and characterization of embedded thin film resistors, capacitors, and inductors. Schaper has investigated materials options for dielectrics in integrated capacitors, comparing paraelectric and ferroelectric materials, and has specifically studied tantalum oxide capacitors on polyimide substrates. The research also addresses thermal management issues and evaluates novel packaging concepts for flexible, three-dimensional designs. Schaper's work contributes to the understanding of materials and device performance required for advanced electronic packaging.
Metrics
- h-index: 7
- Publications: 13
- Citations: 172
Selected Publications
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High density substrates and packaging (2003)
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The mini flex ball-grid-array chip-scale package (2002)
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Materials options for dielectrics in integrated capacitors (2002)
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Electrical characterization of multilayered thin film integral passive devices (2002)
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Embedded thin film resistors, capacitors and inductors in flexible polyimide films (2002)
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Getting aggressive with passive devices (2000)
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