Biography and Research Information
OverviewAI-generated summary
Austin Curbow's research focuses on thermal analysis of electronic components. His recent publication, "Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling" (2023), investigates methods for characterizing thermal properties. This work contributes to understanding heat dissipation in electronic systems, which is crucial for device performance and longevity. Curbow collaborates with several researchers at the University of Arkansas at Fayetteville, including Juan Carlos Balda, Shamar Christian, Jonathan Hayes, and Ty McNutt, indicating an active engagement within the research community.
Metrics
- Publications: 1
Selected Publications
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Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling (2023)
Collaboration Network
Top Collaborators
Shamar Christian
University of Arkansas at Fayetteville
1 shared publication
In database
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
Jonathan Hayes
University of Arkansas at Fayetteville
1 shared publication
In database
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
Brett Sparkman
Cree (China) (CN)
1 shared publication
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
Ty McNutt
Cree (China)
1 shared publication
In database
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
Juan Carlos Balda
University of Arkansas at Fayetteville
1 shared publication
In database
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
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