Simon S. Ang
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Researcher
Also affiliated: Texas Tech University (1997); Atrium Health Wake Forest Baptist (1996); National University of Singapore (2002–2006); Singapore Science Park (2002); Universiti Malaysia Sarawak (2017); University of Colorado Health (1996); Institute of Materials Research and Engineering (2003); Takeda (United States) (2023); Wake Forest University (1996); Texas Instruments (United States) (1987–1988)
Faculty Researcher
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
Simon S. Ang is a faculty member at the University of Arkansas at Fayetteville with a research focus on semiconductor materials and devices. His work has explored the reliability of power electronics packaging and the environmental effects on semiconductor materials, such as gallium nitride heterostructures. Ang has published extensively in his field, with a total of 239 publications and a citation count of 3,340, reflected in his h-index of 29.
His research network includes collaborations with other academics, such as Ardalan Nasiri at the University of Arkansas at Fayetteville, with whom he has co-authored at least one publication. Ang remains an active researcher, with his most recent publication in 2024. His scholarly contributions span various aspects of semiconductor technology and its applications.
Metrics
- h-index: 29
- Publications: 239
- Citations: 3,360
Selected Publications
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Reliability of power electronics packaging (2024)
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Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment (2021)
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Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging (2020)
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High-Temperature Double-Layer Ceramic Packaging Substrates (2020)
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A High-Input Voltage Two-Phase Series-Capacitor DC-DC Buck Converter (2020)
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Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package (2020)
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Submicron guided-mode-resonance filter for wide bandwidth near-infrared polarizer (2020)
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Synthesis, structure, and electrochemical performances of a novel three-dimensional framework K2[Cu(SO4)2] (2019)
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Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design (2019)
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Generation of dual-beam orbital angular momentum vortex beam using transmit arrays (2019)
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Design and Analysis of a New GaN-Based AC/DC Converter for Battery Charging Application (2019)
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High-Frequency Transformer Review and Design for Low-Power Solid-State Transformer Topology (2019)
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Basic Research Needs for Microelectronics: Report of the Office of Science Workshop on Basic Research Needs for Microelectronics, October 23 – 25, 2018 (2018)
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A Single-Step Bidirectional Switch Commutation Strategy for PWM Controlled AC/DC Resonant Converters (2018)
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Packaging Architectures for Silicon Carbide Power Electronic Modules (2018)
Collaboration Network
Top Collaborators
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
- Reliability of power electronics packaging
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