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Presence
Current · Arkansas
Last published
2024
Sources
OpenAlex · ORCID
Refreshed
2026-10-06
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Simon S. Ang
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Also affiliated: Texas Tech University (1997); Atrium Health Wake Forest Baptist (1996); National University of Singapore (2002–2006); Singapore Science Park (2002); Institute of Microelectronics (2002); Institute of Materials Research and Engineering (2003); Wake Forest University (1996); Texas Instruments (United States) (1987–1988)
29 h-index
233 pubs
3,385 cited
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
Simon S. Ang's research has focused on the application of quantum dots for the detection of microbial pathogens, specifically *Cryptosporidium parvum* and *Giardia lamblia*. His work investigates quantum dots as a novel immunofluorescent detection system, utilizing their unique optical properties to identify these protozoan contaminants.
His broader research interests also encompass advancements in power electronics, including the development of digital control strategies for switching converters. Ang has explored the fabrication and testing of microscale devices such as MEMS-based solid propellant microthrusters and thin film microheaters. Additionally, his work has extended to materials science, including the fabrication and characterization of sputtered-carbon microelectrode arrays and transient liquid phase die attach for high-temperature silicon carbide power devices.
Ang holds a significant publication record with 238 total publications and has garnered over 3,300 citations, contributing to his h-index of 29. He has collaborated with researchers at the University of Arkansas at Fayetteville, including Ardalan Nasiri, on shared publications.
Metrics
- h-index: 29
- Publications: 233
- Citations: 3,385
Selected Publications
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Reliability of power electronics packaging (2024)
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Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment (2021)
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Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging (2020)
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High-Temperature Double-Layer Ceramic Packaging Substrates (2020)
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High-Temperature Electronics Packaging for Simulated Venus Condition (2020)
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A High-Input Voltage Two-Phase Series-Capacitor DC-DC Buck Converter (2020)
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Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package (2020)
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Submicron guided-mode-resonance filter for wide bandwidth near-infrared polarizer (2020)
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Synthesis, structure, and electrochemical performances of a novel three-dimensional framework K2[Cu(SO4)2] (2019)
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Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design (2019)
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Generation of dual-beam orbital angular momentum vortex beam using transmit arrays (2019)
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Design and Analysis of a New GaN-Based AC/DC Converter for Battery Charging Application (2019)
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High-Frequency Transformer Review and Design for Low-Power Solid-State Transformer Topology (2019)
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Basic Research Needs for Microelectronics: Report of the Office of Science Workshop on Basic Research Needs for Microelectronics, October 23 – 25, 2018 (2018)
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A Single-Step Bidirectional Switch Commutation Strategy for PWM Controlled AC/DC Resonant Converters (2018)
Collaboration Network
Top Collaborators
W.D. Brown
University of Arkansas at Fayetteville (US)
35 shared publications
- A comparison of mechanical lapping versus chemical-assisted mechanical polishing and planarization of chemical vapor deposited (CVD) diamond
- Reactive Ion Etching of Thin Gold Films
- Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors
- Modeling and electrical analysis of seamless high off-chip connectivity (SHOCC) interconnects
- A study of the high frequency performance of thin film capacitors for electronic packaging
Showing 5 of 35 shared publications
Juan Carlos Balda
University of Arkansas at Fayetteville
17 shared publications
In database
- Realization of a Modular Indirect Matrix Converter System Using Normally Off SiC JFETs
- A 4 kV Silicon Carbide solid-state fault current limiter
- A 6.5kV wire-bondless, double-sided cooling power electronic module
- Harmonic distortion reduction in power inverters
- High Temperature (250 °C) Silicon Carbide Power Modules With Integrated Gate Drive Boards
Showing 5 of 17 shared publications
Hameed A. Naseem
University of Arkansas at Fayetteville
16 shared publications
In database
- Infrared studies of hydrogenated amorphous carbon (a-C:H) and its alloys (a-C:H,N,F)
- A comparison of mechanical lapping versus chemical-assisted mechanical polishing and planarization of chemical vapor deposited (CVD) diamond
- Photoluminescence studies of hydrogenated amorphous carbon and its alloys
- Modeling and electrical analysis of seamless high off-chip connectivity (SHOCC) interconnects
- A study of the high frequency performance of thin film capacitors for electronic packaging
Showing 5 of 16 shared publications
L.W. Schaper
University of Arkansas at Fayetteville
15 shared publications
In database
- Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors
- Modeling and electrical analysis of seamless high off-chip connectivity (SHOCC) interconnects
- Electrical characterization of the interconnected mesh power system (IMPS) MCM topology
- A study of the high frequency performance of thin film capacitors for electronic packaging
- Y1Ba2Cu3O7–xmultilayer structures with a thick SiO2interlayer for multichip modules
Showing 5 of 15 shared publications
Richard K. Ulrich
STMicroelectronics (United States) (US)
14 shared publications
- Effects of nitrogen trifluoride on the growth and properties of plasma-enhanced chemical-vapor-deposited diamond-like carbon films
- Gamma-ray and fast neutron radiation effects on thin film superconductors
- Potentiostatic testing of thin film aluminum corrosion propagation under plasma-enhanced chemically vapor deposited silicon nitride protective films
- Growth and characterization of PECVD semi-insulating polysilicon films and resistors
- Mechanical stability of PECVD silicon nitride protective films over bondwires, bonds and bondpads during thermal stress
Showing 5 of 14 shared publications
H. Alan Mantooth
University of Arkansas at Fayetteville
14 shared publications
In database
- A high temperature, double-sided cooling SiC power electronics module
- Packaging Architectures for Silicon Carbide Power Electronic Modules
- Solid-state fault current limiters: Silicon versus silicon carbide
- A silicon carbide fault current limiter for distribution systems
- An analysis of paralleled SiC bipolar devices
Showing 5 of 14 shared publications
Kaili Zhang
National University of Singapore (SG)
10 shared publications
- A MEMS-based solid propellant microthruster with Au/Ti igniter
- Fabrication, modeling and testing of a thin film Au/Ti microheater
- Development of a low-temperature co-fired ceramic solid propellant microthruster
- Development of a solid propellant microthruster with chamber and nozzle etched on a wafer surface
- MEMS-Based Solid Propellant Microthruster Design, Simulation, Fabrication, and Testing
Showing 5 of 10 shared publications
S.K. Chou
National University of Singapore (SG)
10 shared publications
- A MEMS-based solid propellant microthruster with Au/Ti igniter
- Fabrication, modeling and testing of a thin film Au/Ti microheater
- Development of a low-temperature co-fired ceramic solid propellant microthruster
- Development of a solid propellant microthruster with chamber and nozzle etched on a wafer surface
- MEMS-Based Solid Propellant Microthruster Design, Simulation, Fabrication, and Testing
Showing 5 of 10 shared publications
A.A.O. Tay
National University of Singapore (SG)
9 shared publications
- Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling
- A MEMS based interposer for nano-wafer level packaging test
- Planar Microspring—A Novel Compliant Chip-to-Package Interconnect for Wafer-Level Packaging
- Fabrication and parametric study of wafer-level multiple-copper-column interconnect
- A MEMS-Based Compliant Interconnect for Ultra-Fine-Pitch Wafer Level Packaging
Showing 5 of 9 shared publications
W. D. Brown
University of Arkansas at Fayetteville (US)
9 shared publications
- Radiation characteristics of SIPOS and polysilicon resistors
- Electrical characterization of low-pressure chemical-vapor-deposited silicon dioxide metal-oxide-silicon structures
- PECVD silicon and nitride postbond films for protecting bondpads, bonds and bondwires from corrosion failure
- Highly conductive silicon films via plasma-enhanced chemical vapor deposition at low temperatures
- Metal-oxide-semiconductor structures on germanium/boron doped silicon
Showing 5 of 9 shared publications
Alan Mantooth
University of Arkansas at Fayetteville
8 shared publications
In database
- A 4 kV Silicon Carbide solid-state fault current limiter
- A 6.5kV wire-bondless, double-sided cooling power electronic module
- High Temperature (250 °C) Silicon Carbide Power Modules With Integrated Gate Drive Boards
- High Temperature SiC Power Module Packaging
- Packaging Issues for High-Voltage Power Electronic Modules
Showing 5 of 8 shared publications
Atanu Dutta
University of Arkansas at Fayetteville (US)
7 shared publications
- Electromagnetic Interference Simulations for Wide-Bandgap Power Electronic Modules
- A Module-Level Spring-Interconnected Stack Power Module
- A 3-D stacked wire bondless silicon carbide power module
- Effects of parasitic parameters on electromagnetic interference of power electronic modules
- Electromagnetic interference simulations of power electronic modules
Showing 5 of 7 shared publications
Brian Rowden
University of Arkansas at Fayetteville (US)
7 shared publications
- A 4 kV Silicon Carbide solid-state fault current limiter
- High Temperature (250 °C) Silicon Carbide Power Modules With Integrated Gate Drive Boards
- High Temperature SiC Power Module Packaging
- Packaging Issues for High-Voltage Power Electronic Modules
- Packaging and characterization of silicon carbide thyristor power modules
Showing 5 of 7 shared publications
Akrem M. Elrajoubi
University of Arkansas at Fayetteville (US)
6 shared publications
- TMS320F28335 DSP programming using MATLAB Simulink embedded coder: Techniques and advancements
- Design and Analysis of a New GaN-Based AC/DC Converter for Battery Charging Application
- High-Frequency Transformer Review and Design for Low-Power Solid-State Transformer Topology
- Design and analysis of a new GaN-based AC/DC topology for battery charging application
- Design and evaluation of a high-current gate driver circuit for six paralleled 1.2kV 36A SiC MOSFETs
Showing 5 of 6 shared publications
K.J. Olejniczak
University of Arkansas at Fayetteville (US)
5 shared publications
- Polymer thick film (PTF) and flex technologies for low cost power electronics packaging
- Miniaturizing power electronics using multi-chip module technology
- On the role of diamond, HTS, and a novel MCM topology in the development of multichip power modules (MCPMS) for space applications
- A flip-chip power electronics packaging technology on a flexible polymeric substrates
- Curriculum restructure to answer critical needs in packaging for energy efficiency/renewable energy systems, wireless, and mixed-signal systems areas
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