H. Alan Mantooth Data-verified
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Distinguished Professor of Electrical Engineering
faculty
Research Areas
Biography and Research Information
OverviewAI-generated summary
H. Alan Mantooth, a Distinguished Professor of Electrical Engineering at the University of Arkansas at Fayetteville, focuses his research on power electronics and advancements in semiconductor devices. His work includes investigations into cyber-physical security for photovoltaic systems and power-electronic innovations within these systems. Mantooth has published extensively on topics such as the parallel connection of Silicon Carbide (SiC) MOSFETs, the design of efficient inverters using hybrid Si/SiC switches, and the development of cyber-resilient smart inverters.
His research also encompasses the analysis and control of cascaded energy storage systems for applications like electrified railways, aiming to improve energy efficiency and power quality. Mantooth has also contributed to the understanding of architectural design and system compatibility of power modules and their impact on power electronics systems, as well as the development of design automation flows for multichip power modules.
Mantooth is a highly cited researcher with an h-index of 45 and over 510 publications. He has been a Principal Investigator (PI) or Co-PI on federal grants totaling over $18 million, including significant funding from the National Science Foundation (NSF) for the "Implementation of a National Silicon Carbide Research Fabrication Facility" and the "Center for Infrastructure Trustworthiness in Energy Systems (CITES)." He is a member of the ARA Academy and leads an active research group, collaborating with colleagues at the University of Arkansas.
Metrics
- h-index: 46
- Publications: 524
- Citations: 9,092
Selected Publications
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Dual-channel 2DEG micro-Hall effect sensor for extreme environments (2026)
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Trade-off between Hall sensitivity, temperature stability, and frequency response in a 2DEG nitride Hall-effect sensor (2026)
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Artificial Intelligence for Design Optimization of High Frequency Power Electronics Converters (2025)
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Microgrid Controller Validation via High-Power Alpha Testing Wesley G. Schwartz (2025)
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LAREL: A Reliability-Aware Framework for Power Module Layout Optimization Under Dynamic Drive Cycle Stress (2025)
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A Dynamic Waveform Analysis Methodology in a FPGA Embedded Digital Twin for Secure ANPC Inverter Firmware Validation (2025)
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Parametric Analysis of an AlScN Based Ferroelectric Capacitor Model in a Ferroelectric Memory Bitcell (2025)
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SEU Effect in E-Mode β-Ga <sub>2</sub> О <sub>3</sub> MOSFET with Epitaxial Drift Layer at the Breakdown Region (2025)
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Fabrication and Characterization of 4H-SiC Schottky Barrier Diodes with Highly Linear Temperature Sensitivity (2025)
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A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules (2025)
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TCAD-Aided Investigation of Temperature-Dependent Behavior in 4H-SiC P-Channel MOSFETs Up to 500°C (2025)
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Design and Evaluation of a 650 V, 300 A GaN-Based Power Module with Integrated Drivers and Ultra-Low Inductance Layout (2025)
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Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability (2025)
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A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters (2024)
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A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution (2024)
ARA Academy 2015 ARA Fellow
Dr. Mantooth has established an internationally recognized electronics research program at the University of Arkansas. His team's designs have been deployed on the International Space Station, enduring extreme temperatures and radiation exposure. He has founded and supported three Arkansas-based startup companies, translating research into commercial applications. His economic contributions to the state are estimated to exceed $4 billion.
Policy Impact
Founded three Arkansas-based startup companies with estimated $4B+ economic impact. Designs deployed on the International Space Station.
Growth Areas
['Power Electronics, Advanced Packaging & Grid Management Systems']
Federal Grants 4 $18,499,758 total
Mid-Scale RI-1 (M1:IP): Implementation of a National Silicon Carbide Research Fabrication Facility
Travel: USA-AFRICA WORKSHOP ON COMMUNICATION SYSTEMS AND MICROWAVE TECHNOLOGIES
Conference: USA-Africa Workshop on Communications and Microwave Emerging Technologies
Collaboration Network
Top Collaborators
- A High Efficiency and Low Cost ANPC Inverter Using Hybrid Si/SiC Switches
- Analysis and Control of Cascaded Energy Storage System for Energy Efficiency and Power Quality Improvement in Electrified Railways
- Simple and Effective Adaptive Deadtime Strategies for <i>LLC</i> Resonant Converter: Analysis, Design, and Implementation
- Digital Close-Loop Active Gate Driver for Static and Dynamic Current Sharing of Paralleled SiC MOSFETs
- Self-Tuning Multiport Resonant DC/DC Converter Based on Actively-Controlled Inductors for Hybrid Storage System Integration
Showing 5 of 16 shared publications
- Datasheet-Driven Compact Model of Silicon Carbide Power MOSFET Including Third-Quadrant Behavior
- Computational Efficiency Analysis of SiC MOSFET Models in SPICE: Dynamic Behavior
- Hybrid Si/SiC Switches: A Review of Control Objectives, Gate Driving Approaches and Packaging Solutions
- Comparisons and Evaluations of Silicon and Wide Band Gap Devices at Cryogenic Temperature
- Evaluation and Modeling of SiC Based Power Converter for Low Temperature Operation
Showing 5 of 8 shared publications
- A Review of Current Research Trends in Power-Electronic Innovations in Cyber–Physical Systems
- Analysis and Control of Cascaded Energy Storage System for Energy Efficiency and Power Quality Improvement in Electrified Railways
- Electrothermal-Control Co-Design of an All Silicon Carbide 2×250 kW Dual Inverter for Heavy-Duty Traction Applications
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- 3.3 kV Low-Inductance Full SiC Power Module
Showing 5 of 6 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability
- A Tutorial on High-Density Power Module Packaging
- 3.3 kV Low-Inductance Full SiC Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
Showing 5 of 6 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- 3.3 kV Low-Inductance Full SiC Power Module
- A Double-Sided Cooled Power Module With Embedded Decoupling Capacitors
Showing 5 of 6 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- 3.3 kV Low-Inductance Full SiC Power Module
- Development of a Hybrid Capillary-Driven Single-Phase and Two-Phase Micro-Cooler for Power Electronics Cooling
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- 3.3 kV Low-Inductance Full SiC Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- A Review of Cyber–Physical Security for Photovoltaic Systems
- A Review of Current Research Trends in Power-Electronic Innovations in Cyber–Physical Systems
- Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability
- A General and Automatic RMS Current Oriented Optimal Design Tool for LLC Resonant Converters
- Digital Close-Loop Active Gate Driver for Static and Dynamic Current Sharing of Paralleled SiC MOSFETs
- Digital Active Gate Driving System for Paralleled SiC MOSFETs with Closed-loop Current Balancing Control
- 3.3 kV Low-Inductance Full SiC Power Module
- A Nonlinear-Model-Based High-Bandwidth Current Sensor Design for Switching Current Measurement of Wide Bandgap Devices
- Parallel Connection of Silicon Carbide MOSFETs—Challenges, Mechanism, and Solutions
- Digital Close-Loop Active Gate Driver for Static and Dynamic Current Sharing of Paralleled SiC MOSFETs
- Active Peltier Effect Heat Sink for Power Semiconductor Device Thermal Stability Enhancement
- Comprehensive Analysis of Paralleled SiC MOSFETs Current Imbalance Under Asynchronous Gate Signals
- Parallel Connection of Silicon Carbide MOSFETs—Challenges, Mechanism, and Solutions
- Digital Close-Loop Active Gate Driver for Static and Dynamic Current Sharing of Paralleled SiC MOSFETs
- Active Peltier Effect Heat Sink for Power Semiconductor Device Thermal Stability Enhancement
- Comprehensive Analysis of Paralleled SiC MOSFETs Current Imbalance Under Asynchronous Gate Signals
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
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