Match tier
Likely match
Presence
Current · Arkansas
Last published
2026
Sources
OpenAlex · ORCID
Refreshed
2026-08-08
C
Cheng Tang
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Researcher
Graduate Student Researcher
3 pubs
Research Areas
Biography and Research Information
OverviewAI-generated summary
Cheng Tang is a graduate student at the University of Arkansas at Fayetteville whose research focuses on thermal management solutions for high-power density electronics. Their recent work investigates liquid cooling techniques, specifically utilizing manifold microchannels and embedded microcoolers. Tang's publications explore the thermal-hydraulic optimization and experimental validation of these cooling systems, aiming to enhance efficiency in power modules. This research contributes to the development of more robust and effective thermal management strategies for electronic components operating under high heat flux conditions.
Metrics
- Publications: 3
Selected Publications
-
High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation (2026)
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High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler (2026)
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DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module (2026)
Collaboration Network
Top Collaborators
Yujui Lin
Stanford University (US)
3 shared publications
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
- High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
Man Prakash Gupta
Ford Motor Company (United States) (US)
2 shared publications
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
Michael Degner
Ford Motor Company (United States) (US)
2 shared publications
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
Mehdi Asheghi
Stanford University (US)
2 shared publications
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
- High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
Kenneth E. Goodson
Stanford University (US)
2 shared publications
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
- High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
H. Alan Mantooth
University of Arkansas at Fayetteville
2 shared publications
In database
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
- High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
Kewei Xiao
1 shared publication
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
Mehdi Asheghi
Stanford University (US)
1 shared publication
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
Kenneth Goodson
Stanford University (US)
1 shared publication
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
Alan Mantooth
University of Arkansas at Fayetteville
1 shared publication
In database
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
Hao Chen
Ford Motor Company (United States) (US)
1 shared publication
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
Yu Chen
Ford Motor Company (United States) (US)
1 shared publication
- High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
Behnood Bazmi
University of Illinois Urbana-Champaign (US)
1 shared publication
- High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
S. N. Joshi
University of Illinois Urbana-Champaign (US)
1 shared publication
- High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
W K Park
University of Illinois Urbana-Champaign (US)
1 shared publication
- High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
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