Y
Yarui Peng Data-verified
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Federal Grant PI
Junior Chair Professor
faculty
14 h-index
65 pubs
773 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Yarui Peng's research focuses on computer-aided design, analysis, and optimization for very-large-scale integration (VLSI) circuits and emerging technologies. His work investigates methodologies and algorithms for parasitic extraction, signal integrity analysis and optimization, and the mitigation of reliability issues in thermal and power delivery for 2.5D and 3D integrated circuits (ICs). Peng also studies the improvement of electro-thermal reliability in power systems, such as multi-chip power modules (MCPMs), through layout synthesis and simultaneous optimization of heat dissipation and electrical performance.
Peng received his B.S. from Tsinghua University and M.S. and Ph.D. degrees from Georgia Institute of Technology. He is currently an Assistant Professor in the Computer Science and Computer Engineering Department at the University of Arkansas. He also collaborates with the NSF-sponsored Engineering Research Center for Power Optimization of Electro-Thermal Systems. His work has been supported by the National Science Foundation (NSF) through a CAREER award totaling $500,000 for research on chiplet-package co-optimizations for 2.5D heterogeneous systems-on-chips (SoCs).
With a h-index of 14 and over 764 citations across 65 publications, Peng actively collaborates with researchers at the University of Arkansas, including Imam Al Razi, Quang Trung Le, Tristan M. Evans, and David Huitink. He maintains an active lab website to share his research activities.
Metrics
- h-index: 14
- Publications: 65
- Citations: 773
Selected Publications
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PowerSynth 2: Automated Power Electronics Physical Design Synthesis With Custom and Heterogeneous Components (2025)
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Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System (2025)
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Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth (2023)
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VLSI-Inspired Design Automation for Scalable Power Electronics Layout Optimization (2023)
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A Comparative Study on Optimization Algorithms in PowerSynth 2 (2023)
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Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules (2023)
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Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules (2023)
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PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules (2022)
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Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth (2022)
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Thermal Runaway Mitigation through Electrothermal Constraints Mapping for MCPM Layout Optimization (2022)
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Design Challenges of Intrachiplet and Interchiplet Interconnection (2022)
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Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses (2022)
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Hierarchical Layout Synthesis and Optimization Framework for High-Density Power Module Design Automation (2021)
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Fast and Accurate Inductance Extraction for Power Module Layout Optimization Using Loop-Based Method (2021)
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A Scalable In-Context Design and Extraction Flow for Heterogeneous 2.5D Chiplet-Package Co-Optimization (2021)
Federal Grants 1 $500,000 total
NSF
PI
Jun 2021 - May 2026
CAREER: SHF: Chiplet-Package Co-Optimizations for 2.5D Heterogeneous SoCs with Low-Overhead IOs
Collaboration Network
Top Collaborators
Imam Al Razi
Intel (United States)
12 shared publications
In database
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
- Fast and Accurate Inductance Extraction for Power Module Layout Optimization Using Loop-Based Method
- PowerSynth-Guided Reliability Optimization of Multi-Chip Power Module
Showing 5 of 12 shared publications
H. Alan Mantooth
University of Arkansas at Fayetteville
12 shared publications
In database
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
- Placement and Routing for Power Module Layout
- Fast and Accurate Inductance Extraction for Power Module Layout Optimization Using Loop-Based Method
Showing 5 of 12 shared publications
Quang Trung Le
University of Arkansas at Fayetteville
7 shared publications
In database
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
- Fast and Accurate Inductance Extraction for Power Module Layout Optimization Using Loop-Based Method
- PowerSynth Integrated CAD flow for High Density Power Modules
Showing 5 of 7 shared publications
Tristan M. Evans
University of Arkansas at Fayetteville
6 shared publications
In database
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
- Placement and Routing for Power Module Layout
- Thermal Runaway Mitigation through Electrothermal Constraints Mapping for MCPM Layout Optimization
Showing 5 of 6 shared publications
David Huitink
University of Arkansas at Fayetteville
5 shared publications
In database
- PowerSynth-Guided Reliability Optimization of Multi-Chip Power Module
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
- Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
MD Arafat Kabir
Seva Mandir
3 shared publications
In database
- Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design
- Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design
- Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System
Whit Vinson
University of Arkansas at Fayetteville (US)
3 shared publications
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
David Agogo-Mawuli
University of Arkansas at Fayetteville
3 shared publications
In database
- Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Mehran Sanjabiasasi
University of Arkansas at Fayetteville
3 shared publications
In database
- Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth
- A Comparative Study on Optimization Algorithms in PowerSynth 2
- PowerSynth 2: Automated Power Electronics Physical Design Synthesis With Custom and Heterogeneous Components
Shilpi Mukherjee
University of Arkansas at Fayetteville
2 shared publications
In database
- PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
- Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses
MD Arafat Kabir
University of Arkansas at Fayetteville (US)
2 shared publications
- Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization
- A Scalable In-Context Design and Extraction Flow for Heterogeneous 2.5D Chiplet-Package Co-Optimization
Weishiun Hung
2 shared publications
- Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization
- Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System
Tsung-Yi Ho
Chinese University of Hong Kong (HK)
2 shared publications
- Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization
- Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System
Dusan Petranovic
Siemens (Hungary) (HU)
2 shared publications
- Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design
- A Scalable In-Context Design and Extraction Flow for Heterogeneous 2.5D Chiplet-Package Co-Optimization
Collin Ruby
University of Arkansas at Fayetteville
2 shared publications
In database
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
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