S
Shamar Christian Data-verified
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Researcher
faculty
5 h-index
12 pubs
150 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Shamar Christian's research focuses on the thermal management and power density of electronic devices, particularly in automotive applications. He has investigated methods to enhance cooling efficiency using additively manufactured hybrid polymer-metal coolers and inductor encapsulation. His work also includes the development of high power density converters and traction inverters utilizing Silicon Carbide (SiC) devices. Christian has published on topics such as synchronous-variable-frequency control of bidirectional DC-DC converters and techniques for determining thermal impedance and coupling. He collaborates with researchers at the University of Arkansas at Fayetteville, including Juan Carlos Balda, with whom he has co-authored nine publications. Christian's scholarly output includes 12 publications with 150 citations and an h-index of 5.
Metrics
- h-index: 5
- Publications: 12
- Citations: 150
Selected Publications
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A 155 KW/L 800 V Traction Inverter Using Discrete SiC Devices (2025)
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Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling (2023)
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DC-Side Soft-Switching Inverter With Modified Space-Vector Modulation Scheme (2023)
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Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores (2022)
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Inductor Encapsulation-Based Thermal Management Enabling Increased Power Density (2022)
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High Power Density Interleaved ZCS 80-kW Boost Converter for Automotive Applications (2021)
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Synchronous-Variable-Frequency Control of Bidirectional DCM Interleaved DC–DC Converter for Wide-Range Enhanced Efficiency (2021)
Collaboration Network
Top Collaborators
Juan Carlos Balda
University of Arkansas at Fayetteville
9 shared publications
In database
- High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
- High Power Density Interleaved ZCS 80-kW Boost Converter for Automotive Applications
- Synchronous-Variable-Frequency Control of Bidirectional DCM Interleaved DC–DC Converter for Wide-Range Enhanced Efficiency
- Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores
- Minimizing DC-Link Capacitor RMS Current in Power Conversion Units Through Synchronous Operation
Showing 5 of 9 shared publications
Roberto A. Fantino
Universidad Nacional del Sur (AR)
6 shared publications
- High Power Density Interleaved ZCS 80-kW Boost Converter for Automotive Applications
- Synchronous-Variable-Frequency Control of Bidirectional DCM Interleaved DC–DC Converter for Wide-Range Enhanced Efficiency
- Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores
- Minimizing DC-Link Capacitor RMS Current in Power Conversion Units Through Synchronous Operation
- Inductor Encapsulation-Based Thermal Management Enabling Increased Power Density
Showing 5 of 6 shared publications
Roderick Amir Gomez
University of Arkansas at Fayetteville
3 shared publications
In database
- High Power Density Interleaved ZCS 80-kW Boost Converter for Automotive Applications
- Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores
- Inductor Encapsulation-Based Thermal Management Enabling Increased Power Density
Yue Zhao
University of Arkansas at Fayetteville
2 shared publications
In database
- High Power Density Interleaved ZCS 80-kW Boost Converter for Automotive Applications
- Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores
Asim Amir Solangi
University of Arkansas at Fayetteville
2 shared publications
In database
- Minimizing DC-Link Capacitor RMS Current in Power Conversion Units Through Synchronous Operation
- DC-Side Soft-Switching Inverter With Modified Space-Vector Modulation Scheme
Aniket Ajay Lad
University of Illinois Urbana-Champaign (US)
2 shared publications
- High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
- A 155 KW/L 800 V Traction Inverter Using Discrete SiC Devices
Nenad Miljkovic
University of Illinois Urbana-Champaign (US)
2 shared publications
- High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
- A 155 KW/L 800 V Traction Inverter Using Discrete SiC Devices
Muhammad Jahidul Hoque
University of Illinois Urbana-Champaign (US)
1 shared publication
- High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
Yue Zhao
University of Illinois Urbana-Champaign (US)
1 shared publication
- High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
William P. King
University of Illinois Urbana-Champaign (US)
1 shared publication
- High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
Germán G. Oggier
National University of Río Cuarto (AR)
1 shared publication
- Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores
Jonathan Hayes
University of Arkansas at Fayetteville
1 shared publication
In database
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
Brett Sparkman
Cree (China) (CN)
1 shared publication
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
Ausitn Curbow
University of Arkansas at Fayetteville
1 shared publication
In database
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
Ty McNutt
Cree (China)
1 shared publication
In database
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
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