Match tier
Confirmed
Presence
Current · Arkansas
Last published
2022
Sources
OpenAlex · ORCID
Refreshed
2026-10-07
M
Mahsa Montazeri
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
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6 h-index
17 pubs
97 cited
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
Mahsa Montazeri's research focuses on understanding and mitigating complications following esophageal surgery, particularly anastomotic leaks after esophagectomy for esophageal cancer. Her work has contributed to the development of scoring systems, such as the SEAL score, to assess the severity of these leaks. She has also been involved in large, collaborative observational studies, like the TENTACLE cohort, to investigate treatment outcomes for anastomotic leaks. Montazeri's broader research interests extend to the reliability and performance of semiconductor devices, with publications exploring solder interconnect fatigue life, thermomechanical reliability, and the optimization of MOSFETs for switching performance. She has also investigated additive manufacturing processes for microheater arrays and direct cooling of power converters using dielectric liquid forced convection.
Metrics
- h-index: 6
- Publications: 17
- Citations: 97
Selected Publications
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Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions (2022)
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Direct cooling of a planar magnetic converter using dielectric liquid forced convection enabled by additive manufacturing (2022)
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Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects (2020)
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Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance (2020)
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Fabrication of Copper Compliant Iinterconnects on a Printed Circuit Board: An Additive Approach (2020)
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Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design (2019)
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In Situ Resistance Monitoring and Fatigue Life Prediction for Flip-Chip Solder Interconnects Using RAPID Mechanical Cycling Method (2019)
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Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test (2019)
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Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction (2018)
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Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability (2018)
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Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET (2018)
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Microheater array powder sintering: A novel additive manufacturing process (2017)
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Fabrication and control of a microheater array for Microheater Array Powder Sintering (2017)
Collaboration Network
Top Collaborators
David Huitink
University of Arkansas at Fayetteville
11 shared publications
In database
- Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- Direct cooling of a planar magnetic converter using dielectric liquid forced convection enabled by additive manufacturing
- Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
- Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
Showing 5 of 11 shared publications
Cody J. Marbut
University of Arkansas at Fayetteville
4 shared publications
In database
- Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability
- Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
- In Situ Resistance Monitoring and Fatigue Life Prediction for Flip-Chip Solder Interconnects Using RAPID Mechanical Cycling Method
- Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction
Nicholas L. Holt
University of Arkansas at Fayetteville (US)
2 shared publications
- Microheater array powder sintering: A novel additive manufacturing process
- Fabrication and control of a microheater array for Microheater Array Powder Sintering
Sayan Seal
University of Arkansas at Fayetteville
2 shared publications
In database
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
Andrea K. Wallace
Northrop Grumman (United States) (US)
2 shared publications
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
Lucas Marques
University of Arkansas at Fayetteville (US)
1 shared publication
- Fabrication and control of a microheater array for Microheater Array Powder Sintering
Austin Van Horn
University of Arkansas at Fayetteville (US)
1 shared publication
- Fabrication and control of a microheater array for Microheater Array Powder Sintering
Wenchao Zhou
University of Arkansas at Fayetteville (US)
1 shared publication
- Fabrication and control of a microheater array for Microheater Array Powder Sintering
Ausitn Van Horn
University of Arkansas at Fayetteville (US)
1 shared publication
- Microheater array powder sintering: A novel additive manufacturing process
Wenchao Zhou
University of Arkansas at Fayetteville
1 shared publication
In database
- Microheater array powder sintering: A novel additive manufacturing process
Alan Mantooth
University of Arkansas at Fayetteville
1 shared publication
In database
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
John Harris
University of Arkansas at Fayetteville (US)
1 shared publication
- Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
Adithya Venkatanarayanan
University of Arkansas at Fayetteville
1 shared publication
In database
- Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
Simon S. Ang
University of Arkansas at Fayetteville
1 shared publication
In database
- Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
Tumininu Olatunji
University of Arkansas at Fayetteville (US)
1 shared publication
- Fabrication of Copper Compliant Iinterconnects on a Printed Circuit Board: An Additive Approach
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