R
Reece Whitt Data-verified
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Researcher
faculty
6 h-index
17 pubs
241 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Reece Whitt's research focuses on the thermal management of high-power electronics, particularly in the context of electric vehicle traction inverters and other power electronic systems. His work investigates methods to enhance heat dissipation and control junction temperatures, which are critical for the performance and longevity of these components. Whitt has explored advanced cooling techniques such as variable area jet impingement and additively manufactured heat spreaders. He has also contributed to the design and evaluation of low-inductance power modules with integrated microchannel coolers, utilizing materials like silicon carbide (SiC). His scholarship includes several publications in this area, with key collaborators including David Huitink and Xiaoqing Song from the University of Arkansas at Fayetteville. Whitt's research is characterized by experimental validation and computational modeling of thermal systems.
Metrics
- h-index: 6
- Publications: 17
- Citations: 241
Selected Publications
-
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics (2024)
-
Variable Area Jet Impingement for High Voltage Power Electronics (2023)
-
Converging Jet Impingement for Enhanced Liquid Cooling (2023)
-
Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler (2023)
-
Thermal Management Performance of an Additively Manufactured Jet Impingement Cooler for Power Electronics (2022)
-
Dual Converging Jets for Enhanced Liquid Impingement Cooling (2022)
-
Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling (2022)
-
Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter (2022)
Collaboration Network
Top Collaborators
David Huitink
University of Arkansas at Fayetteville
8 shared publications
In database
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
- Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
- Thermal Management Performance of an Additively Manufactured Jet Impingement Cooler for Power Electronics
- Converging Jet Impingement for Enhanced Liquid Cooling
- Variable Area Jet Impingement for High Voltage Power Electronics
Showing 5 of 8 shared publications
Rafael Estrella
University of Arkansas at Fayetteville (US)
3 shared publications
- Converging Jet Impingement for Enhanced Liquid Cooling
- Durability of Non-Metallic Additive Manufactured Jet Impingement Manifolds in Elevated Temperature Power Electronics Thermal Management
- Dual Converging Jets for Enhanced Liquid Impingement Cooling
Skyler Hudson
1 shared publication
- Durability of Non-Metallic Additive Manufactured Jet Impingement Manifolds in Elevated Temperature Power Electronics Thermal Management
Zhao Yuan
University of Arkansas at Fayetteville (US)
1 shared publication
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
Asif Imran Emon
Stony Brook University (US)
1 shared publication
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
Fang Luo
Stony Brook University (US)
1 shared publication
- Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter
Zion Clarke
Howard University (US)
1 shared publication
- Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling
Sonya Smith
Howard University (US)
1 shared publication
- Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling
Hao Chen
University of Arkansas at Fayetteville (US)
1 shared publication
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Yujui Lin
Stanford University (US)
1 shared publication
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Tiwei Wei
Purdue University West Lafayette (US)
1 shared publication
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Xiaoling Li
University of Arkansas at Fayetteville (US)
1 shared publication
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Riya Paul
University of Arkansas at Fayetteville (US)
1 shared publication
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Xiaoqing Song
University of Arkansas at Fayetteville
1 shared publication
In database
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Yue Zhao
University of Arkansas at Fayetteville
1 shared publication
In database
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Similar Researchers
Based on overlapping research topics
Tijesunimi Akintunde
University of Arkansas at Fayetteville
Advancements in Semiconductor Devices and Circuit Design
Heat Transfer and Thermal Management
Materials Science Research
Yue Zhao
University of Arkansas at Fayetteville
Advancements in Semiconductor Devices and Circuit Design
Heat Transfer and Thermal Management
Materials Science Research
Cole Sherrill
University of Arkansas at Fayetteville
Advancements in Semiconductor Devices and Circuit Design
Materials Science Research
Semiconductor materials and devices
Aireen Amir Jalal
University of Arkansas at Fayetteville
Advancements in Semiconductor Devices and Circuit Design
Materials Science Research
Semiconductor materials and devices
David Gonzalez Castillo
University of Arkansas at Fayetteville
Advancements in Semiconductor Devices and Circuit Design
Materials Science Research
Semiconductor materials and devices
Gabriel Okafor
University of Arkansas at Fayetteville
Advancements in Semiconductor Devices and Circuit Design
Materials Science Research
Semiconductor materials and devices