Reece Whitt

This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.

Researcher

University of Arkansas

Faculty Researcher

7 h-index 17 pubs 250 cited

Research Areas

Links

ORCID Research Group

OverviewAI-generated summary

Reece Whitt's research focuses on the thermal management of high-power electronics, particularly in the context of electric vehicle traction inverters. His work investigates advanced cooling techniques to enhance the performance and reliability of these systems. Recent publications explore the design and evaluation of electrothermal systems with low electromagnetic interference (EMI) and balanced thermal characteristics.

Whitt has studied the fabrication and experimental validation of low-inductance silicon carbide (SiC) power modules integrated with microchannel coolers. His research also examines variable area jet impingement as a method for improved junction temperature control in high-voltage power electronics. Additional studies have assessed the thermal management performance of additively manufactured jet impingement coolers and explored the use of dual converging jets for enhanced liquid cooling. He collaborates with David Huitink, Xiaoqing Song, and Xiaoling Li at the University of Arkansas at Fayetteville.

Metrics

h-index: 7
Publications: 17
Citations: 250

Selected Publications

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics (2024)

Journal of Electronic Packaging 6 citations DOI OpenAlex
Variable Area Jet Impingement for High Voltage Power Electronics (2023)

1 citation DOI OpenAlex
Converging Jet Impingement for Enhanced Liquid Cooling (2023)

Journal of Electronic Packaging 4 citations DOI OpenAlex
Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler (2023)

7 citations DOI OpenAlex
Thermal Management Performance of an Additively Manufactured Jet Impingement Cooler for Power Electronics (2022)

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 3 citations DOI OpenAlex
Dual Converging Jets for Enhanced Liquid Impingement Cooling (2022)

1 citation DOI OpenAlex
Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling (2022)

DOI OpenAlex
Electrothermal System Design and Evaluation of Low EMI and Thermally Balanced 150 kW T-Type Traction Inverter (2022)

IEEE Transactions on Power Electronics 12 citations DOI OpenAlex
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization (2020)

Journal of Electronic Packaging 13 citations DOI OpenAlex
Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers (2020)

IEEE Transactions on Power Electronics 35 citations DOI OpenAlex
Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review (2020)

Heat Transfer Engineering 109 citations DOI OpenAlex
Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization (2019)

5 citations DOI OpenAlex
THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES (2019)

IMAPSource Proceedings 3 citations DOI OpenAlex
Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application (2019)

35 citations DOI OpenAlex
Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics (2019)

13 citations DOI OpenAlex