Match tier
Likely match
Presence
Current · Arkansas
Last published
2025
Sources
OpenAlex · ORCID
Refreshed
2026-10-05
A
Amol Deshpande
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Hardware Development Engineer
Also affiliated: The Ohio State University (2015–2017)
16 h-index
33 pubs
793 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Amol Deshpande's research focuses on the development and evaluation of power electronic systems, particularly those utilizing silicon carbide (SiC) and insulated-gate bipolar transistor (IGBT) technologies. His work has included the design of high power-density building blocks for applications such as aircraft electric-propulsion drives and traction inverters. Deshpande has investigated hybrid switch configurations combining Si IGBTs with SiC MOSFETs, examining factors like parasitic interconnect influences, cost, and current ratio optimization.
His research also encompasses the design and evaluation of power modules and laminated busbars, with an emphasis on enhanced dynamic current sharing and electromagnetic interference (EMI) shielding. Deshpande has explored the thermal and electrical performance of high-voltage power modules, including those employing additively manufactured coolers. He has contributed to the development of three-level T-type Neutral Point Clamped (NPC) power modules and phase-leg power electronic building blocks for aircraft motor driving applications.
Deshpande received his M.S. from The Ohio State University and his Ph.D. from the University of Arkansas, where he was a Graduate Research Assistant with the NSF POETS ERC. He has co-authored over 30 journal articles and conference papers and received a Best Paper Award at the 2016 IEEE Energy Conversion Congress and Exposition (ECCE). He currently works as a Hardware Development Engineer at Wolfspeed, Inc., focusing on medium- and high-voltage power module research and development.
Metrics
- h-index: 16
- Publications: 33
- Citations: 793
Positions
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Hardware Development Engineer 2020–presentWolfspeed, Inc. ORCID
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Hardware Development Engineer publications 2018–2025University of Arkansas at Fayetteville ORCID
Selected Publications
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Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module (2025)
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Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module (2022)
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A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications (2021)
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A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC (2021)
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1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding (2021)
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Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite (2020)
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High Power Density 1700-V/ 300-A Si-IGBT and SiC-MOSFET Hybrid Switch-based Half-bridge Power Module (2020)
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A 1200V/650V/160A SiC+Si IGBT 3-Level T-type NPC Power Module with Optimized Loop Inductance (2020)
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Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers (2020)
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Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications (2020)
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Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic Graphite (2019)
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Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization (2019)
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Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application (2019)
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Design of a High-Efficiency, High Specific-Power Three-Level T-Type Power Electronics Building Block for Aircraft Electric-Propulsion Drives (2019)
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Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing (2019)
Collaboration Network
Top Collaborators
Fang Luo
Stony Brook University (US)
22 shared publications
- Practical Design Considerations for a Si IGBT + SiC MOSFET Hybrid Switch: Parasitic Interconnect Influences, Cost, and Current Ratio Optimization
- Design of a High-Efficiency, High Specific-Power Three-Level T-Type Power Electronics Building Block for Aircraft Electric-Propulsion Drives
- Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
Showing 5 of 22 shared publications
Zhao Yuan
University of Arkansas at Fayetteville (US)
12 shared publications
- Design of a High-Efficiency, High Specific-Power Three-Level T-Type Power Electronics Building Block for Aircraft Electric-Propulsion Drives
- Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Comprehensive Analysis of Three-phase Three-level T-type Neutral-Point-Clamped Inverter with Hybrid Switch Combination
Showing 5 of 12 shared publications
Balaji Narayanasamy
University of Arkansas at Fayetteville
11 shared publications
In database
- Design of a High-Efficiency, High Specific-Power Three-Level T-Type Power Electronics Building Block for Aircraft Electric-Propulsion Drives
- Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Comprehensive Analysis of Three-phase Three-level T-type Neutral-Point-Clamped Inverter with Hybrid Switch Combination
- A three-level, T-type, power electronics building block using Si-SiC hybrid switch for high-speed drives
Showing 5 of 11 shared publications
Asif Imran Emon
Stony Brook University (US)
9 shared publications
- Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers
- A 1200V/650V/160A SiC+Si IGBT 3-Level T-type NPC Power Module with Optimized Loop Inductance
Showing 5 of 9 shared publications
Hongwu Peng
University of Arkansas at Fayetteville (US)
7 shared publications
- Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Comprehensive Analysis of Three-phase Three-level T-type Neutral-Point-Clamped Inverter with Hybrid Switch Combination
- A 1200V/650V/160A SiC+Si IGBT 3-Level T-type NPC Power Module with Optimized Loop Inductance
- Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module
Showing 5 of 7 shared publications
David Huitink
University of Arkansas at Fayetteville
6 shared publications
In database
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers
- Stacked DBC Cavitied Substrate for a 15-kV Half-bridge Power Module
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
Showing 5 of 6 shared publications
Riya Paul
University of Arkansas at Fayetteville (US)
5 shared publications
- A 1200V/650V/160A SiC+Si IGBT 3-Level T-type NPC Power Module with Optimized Loop Inductance
- Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module
- High Power Density 1700-V/ 300-A Si-IGBT and SiC-MOSFET Hybrid Switch-based Half-bridge Power Module
- Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic Graphite
- Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite
Reece Whitt
University of Arkansas at Fayetteville
4 shared publications
In database
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
Mustafeez Ul Hassan
Stony Brook University (US)
4 shared publications
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Bakhtiyar Mohammad Nafis
University of Arkansas at Fayetteville
3 shared publications
In database
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
Yingzhuo Chen
Tesla (United States) (US)
2 shared publications
- Design of a High-Efficiency, High Specific-Power Three-Level T-Type Power Electronics Building Block for Aircraft Electric-Propulsion Drives
- A three-level, T-type, power electronics building block using Si-SiC hybrid switch for high-speed drives
Cai Chen
Huazhong University of Science and Technology (CN)
2 shared publications
- Design of a High-Efficiency, High Specific-Power Three-Level T-Type Power Electronics Building Block for Aircraft Electric-Propulsion Drives
- Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing
Asif Imran
University of Arkansas at Fayetteville (US)
2 shared publications
- High Power Density 1700-V/ 300-A Si-IGBT and SiC-MOSFET Hybrid Switch-based Half-bridge Power Module
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
Abdul Basit Mirza
Stony Brook University (US)
2 shared publications
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Zhongjing Wang
University of Arkansas at Fayetteville (US)
2 shared publications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
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