Match tier
Likely match
Presence
Current · Arkansas
Last published
2025
Sources
OpenAlex · ORCID
Refreshed
2026-08-15
A
Amol Deshpande
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Hardware Development Engineer
Also affiliated: The Ohio State University (2015–2017)
Faculty Researcher
16 h-index
34 pubs
785 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Amol Deshpande's research focuses on the development and characterization of advanced power modules, particularly those utilizing wide-bandgap semiconductor materials like silicon carbide (SiC). During his graduate studies at the University of Arkansas, he contributed to research on high power-density SiC building blocks, traction inverters, and power modules as a Graduate Research Assistant with the NSF POETS ERC. His work involved investigating technologies for improved power conversion and management.
In his current role as a Hardware Development Engineer at Wolfspeed, Inc., Deshpande is responsible for the research and development of medium- and high-voltage power modules. His recent publications highlight work on hybrid SiC and Si IGBT modules, 3-level Neutral Point Clamped (3L-TNPC) power modules for high-density applications, and SiC-MOSFET based inverters. He also has research interests in partial discharge source identification for diagnosis in high voltage rotating machines.
Deshpande has co-authored over 30 publications and received a Best Paper Award at the 2016 IEEE Energy Conversion Congress and Exposition (ECCE). His scholarship metrics include an h-index of 15 and over 750 citations. His collaborators include Balaji Narayanasamy from the University of Arkansas at Fayetteville.
Metrics
- h-index: 16
- Publications: 34
- Citations: 785
Selected Publications
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Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module (2025)
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Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module (2022)
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A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications (2021)
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A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC (2021)
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1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding (2021)
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Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite (2020)
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High Power Density 1700-V/ 300-A Si-IGBT and SiC-MOSFET Hybrid Switch-based Half-bridge Power Module (2020)
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A 1200V/650V/160A SiC+Si IGBT 3-Level T-type NPC Power Module with Optimized Loop Inductance (2020)
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Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers (2020)
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Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications (2020)
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Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic Graphite (2019)
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Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization (2019)
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Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application (2019)
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Design of a High-Efficiency, High Specific-Power Three-Level T-Type Power Electronics Building Block for Aircraft Electric-Propulsion Drives (2019)
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Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing (2019)
Collaboration Network
Top Collaborators
Fang Luo
Stony Brook University (US)
5 shared publications
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Asif Imran Emon
Stony Brook University (US)
4 shared publications
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
Zhao Yuan
University of Arkansas at Fayetteville (US)
4 shared publications
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
Mustafeez Ul Hassan
Stony Brook University (US)
4 shared publications
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Abdul Basit Mirza
Stony Brook University (US)
2 shared publications
- 1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Zhongjing Wang
University of Arkansas at Fayetteville (US)
2 shared publications
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
Hongwu Peng
University of Arkansas at Fayetteville (US)
2 shared publications
- Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
Balaji Narayanasamy
University of Arkansas at Fayetteville
2 shared publications
In database
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
Yalin Wang
University of Arkansas at Fayetteville (US)
2 shared publications
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
- A Three-phase 450 kVA SiC-MOSFET Based Inverter With High Efficiency and High Power Density By Using 3L-TNPC
Si Huang
University of Arkansas at Fayetteville (US)
1 shared publication
- A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications
Riya Paul
University of Arkansas at Fayetteville (US)
1 shared publication
- Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module
Yang Li
Stony Brook University (US)
1 shared publication
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Shiyue Deng
Stony Brook University (US)
1 shared publication
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Yuxuan Wu
Stony Brook University (US)
1 shared publication
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
Yang Xie
Stony Brook University (US)
1 shared publication
- Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module
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