Match tier Confirmed
Presence Current · Arkansas
Last published 2026
Sources OpenAlex · ORCID
Refreshed 2026-10-08

Zhuowen Feng

Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.

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Also affiliated: China Jiliang University (2025); Guangdong Ocean University (2023–2026)

4 h-index 11 pubs 74 cited

Biography and Research Information

OverviewAI-generated summary

Zhuowen Feng's research interests lie in the field of electrical engineering, with a particular focus on power electronics and semiconductor devices. His work includes investigations into 1.2 kV Silicon Carbide (SiC) power Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) and the application of wide bandgap semiconductors in resonant converters designed for solar energy systems. Feng has also explored ultrafast power module applications. His academic background includes a B.S. from Jilin University and an M.S. in electrical engineering from George Mason University, and he is currently pursuing a Ph.D. at the University of Arkansas. His scholarly output includes publications on SiC CMOS technology for demanding environments, organic electronic applications, and autonomous exploration for unmanned aerial vehicles. Feng has a productive collaboration network at the University of Arkansas, with multiple shared publications with researchers including Pengyu Lai and Zuhuang Chen.

Metrics

  • h-index: 4
  • Publications: 11
  • Citations: 74

Selected Publications

  • An Embedded High-Temperature LTCC Rogowski-Coil Current Sensor for SiC Intelligent Power Modules (2026)
    IEEE Transactions on Power Electronics DOI OpenAlex
  • A New Simulation Method to Assess Temperature and Radiation Effects on SiC Resonant-Converter Reliability (2026)
    Materials DOI OpenAlex
  • A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules (2025)
  • A New Simulation Method to Assess Temperature and Radiation Effects on SiC Resonant-Converter Reliability (2025)
    Preprints.org DOI OpenAlex
  • Use of E-Beam Lithography to Optimize Lithography Patterning on SiC Wafers (2025)
    IEEE Transactions on Semiconductor Manufacturing 2 citations DOI OpenAlex
  • A 200 ∘C SiC Phase-Leg Power Module With Integrated Gate Drivers: Development, Performance Assessment, and Path Forward (2025)
    IEEE Journal of Emerging and Selected Topics in Power Electronics 1 citation DOI OpenAlex
  • A review of silicon carbide CMOS technology for harsh environments (2024)
    Materials Science in Semiconductor Processing 46 citations DOI OpenAlex

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Collaboration Network

38 Collaborators 6 Institutions 2 Countries

Top Collaborators

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