Ty McNutt
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Researcher
Also affiliated: National Institute of Standards and Technology (2004–2006); Northrop Grumman (United States) (2005–2009); Cree (China) (2018–2023); Northrop Grumman (Germany) (2007–2008); Fayetteville Public Library (2017); Arkansas Power Electronics International (2004–2016)
Faculty Researcher
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Ty McNutt's research focuses on thermal management in electronic systems, investigating methods to determine thermal impedance and coupling. His recent publication, "Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling," published in 2023, exemplifies this work. McNutt has a scholarly profile with an h-index of 21, reflecting 106 total publications that have garnered 2,138 citations. He is recognized as a highly cited researcher. McNutt collaborates with several faculty members at the University of Arkansas at Fayetteville, including Juan Carlos Balda, Shamar Christian, Jonathan Hayes, and Austin Curbow, with whom he has co-authored publications.
Metrics
- h-index: 21
- Publications: 106
- Citations: 2,156
Selected Publications
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Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling (2023)
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UARK SiC Power MOSFET Model (2017)
Collaboration Network
Top Collaborators
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
- Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
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