Joshua Tompkins
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Researcher
Unknown Researcher
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Biography and Research Information
OverviewAI-generated summary
Joshua Tompkins researches the reliability and thermal management of power electronics. His work investigates thermal interface material degradation, particularly in Highly Accelerated Life Testing (HALT) environments, as demonstrated in his 2021 and 2022 publications. Tompkins also explores methods for enhancing power electronics reliability through temperature balancing, including techniques such as airflow inversion cooling, as detailed in his 2026 publication. He has collaborated with several researchers at the University of Arkansas at Fayetteville, including Haitao Liao, David Huitink, Alicia Medina Garcia, and Yue Zhao, on shared publications. Tompkins's scholarly output includes a total of six publications, which have garnered 12 citations, and he holds an h-index of 2.
Metrics
- h-index: 2
- Publications: 6
- Citations: 12
Selected Publications
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Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling (2026)
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Module-Level Thermal Interface Material Degradation in HALT (2022)
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Module-Level TIM Degradation in HALT (2021)
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Air Flow Inversion for Enhanced Electronics Cooling in Additively Manufactured Air Channels (2020)
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Induction heating response of iron oxide nanoparticles in varyingly viscous mediums with prediction of brownian heating contribution (2020)
Collaboration Network
Top Collaborators
- Module-Level Thermal Interface Material Degradation in HALT
- Module-Level TIM Degradation in HALT
- Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling
- Module-Level Thermal Interface Material Degradation in HALT
- Module-Level Thermal Interface Material Degradation in HALT
- Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling
- Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling
- Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling
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