A
Ange-Christian Iradukunda Data-verified
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Researcher
faculty
6 h-index
15 pubs
354 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Ange-Christian Iradukunda's research centers on the thermal management of high-density power electronics. His work investigates advanced cooling techniques, including the use of dielectric fluids in microchannel heat sinks, to improve the performance and durability of high-voltage, high-power modules. He has also explored the integration of multifunctional materials, such as magnetic nanocomposites, for electromagnetic interference (EMI) shielding within power electronic systems. His publications include a tutorial on high-density power module packaging and studies validating voltage blocking technologies for direct cooling applications. Iradukunda has collaborated with researchers David Huitink, Yuxiang Chen, Sarah Myane, and H. Alan Mantooth at the University of Arkansas at Fayetteville on multiple shared publications. His scholarly output is marked by an h-index of 6 and 348 total citations across 15 publications.
Metrics
- h-index: 6
- Publications: 15
- Citations: 354
Selected Publications
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Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024)
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A Tutorial on High-Density Power Module Packaging (2022)
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Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics (2022)
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Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules (2021)
Collaboration Network
Top Collaborators
David Huitink
University of Arkansas at Fayetteville
6 shared publications
In database
- A Tutorial on High-Density Power Module Packaging
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
Showing 5 of 6 shared publications
Tarek Gebrael
University of Illinois Urbana-Champaign (US)
2 shared publications
- Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
- Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
Noah Akey
2 shared publications
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
Sarah Myane
2 shared publications
In database
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
Fang Luo
2 shared publications
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
Asif Imran
2 shared publications
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
Yuxiang Chen
University of Arkansas at Fayetteville
2 shared publications
In database
- A Tutorial on High-Density Power Module Packaging
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
H. Alan Mantooth
University of Arkansas at Fayetteville
2 shared publications
In database
- A Tutorial on High-Density Power Module Packaging
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
Nenad Miljkovic
University of Illinois Urbana-Champaign (US)
1 shared publication
- Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
Hayden Carlton
1 shared publication
- Multifunctional Magnetic Nanocomposite Encapsulant for Emi Shielding in Power Electronics
Nenad Miljkovic
University of Illinois Urbana-Champaign (US)
1 shared publication
- Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
Zhong Chen
University of Arkansas at Fayetteville
1 shared publication
In database
- A Tutorial on High-Density Power Module Packaging
Bakhtiyar Mohammad Nafis
University of Arkansas at Fayetteville
1 shared publication
In database
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
Geoff Campbell
Micro Cooling Concepts (United States) (US)
1 shared publication
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
David Underwood
Micro Cooling Concepts (United States) (US)
1 shared publication
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
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