Ange-Christian Iradukunda

This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.

Researcher

University of Arkansas

Faculty Researcher

6 h-index 15 pubs 370 cited

Research Areas

Links

ORCID Lab Website

OverviewAI-generated summary

Ange-Christian Iradukunda's research focuses on advancements in high-density power electronics packaging and cooling technologies. His work investigates methods for direct cooling of high-voltage power modules, including the use of dielectric fluids in microchannel embedded bussing terminals. Iradukunda has published on validating voltage blocking technologies to enable direct cooling of high-power modules and exploring multifunctional magnetic nanocomposites for electromagnetic interference (EMI) shielding in power electronics. He has collaborated with researchers at the University of Arkansas at Fayetteville, including David Huitink, Kevin Chen, Sarah Myane, and H. Alan Mantooth.

His publications also include a tutorial on high-density power module packaging and studies on coolant dielectric strength augmentation under convective conditions. With an h-index of 6 and 363 citations across 15 publications, Iradukunda is an active contributor to the field of power electronics.

Metrics

h-index: 6
Publications: 15
Citations: 370

Selected Publications

Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024)

IEEE Transactions on Components Packaging and Manufacturing Technology 5 citations DOI OpenAlex
A Tutorial on High-Density Power Module Packaging (2022)

IEEE Journal of Emerging and Selected Topics in Power Electronics 27 citations DOI OpenAlex
Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics (2022)

DOI OpenAlex
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions (2022)

Journal of Electronic Packaging 6 citations DOI OpenAlex
Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules (2021)

DOI OpenAlex
Topology Optimized Phase Change Material Integrated Heat sinks and Validation (2020)

6 citations DOI OpenAlex
Transient thermal performance using phase change material integrated topology optimized heat sinks (2020)

Applied Thermal Engineering 93 citations DOI OpenAlex
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials (2020)

Journal of Electronic Packaging 13 citations DOI OpenAlex
Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review (2020)

Heat Transfer Engineering 109 citations DOI OpenAlex
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications (2020)

Journal of Electronic Packaging 7 citations DOI OpenAlex
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles (2019)

1 citation DOI OpenAlex
Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems (2019)

DOI OpenAlex
A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages (2019)

IEEE Journal of Emerging and Selected Topics in Power Electronics 104 citations DOI OpenAlex
Topology Optimized Fins for a PCM-Based Thermal Management System (2019)

3 citations DOI OpenAlex