Bakhtiyar Mohammad Nafis Data-verified
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Biography and Research Information
OverviewAI-generated summary
Bakhtiyar Mohammad Nafis, a faculty member at the University of Arkansas at Fayetteville, investigates the reliability and risk assessment of power electronic systems, particularly those utilizing Silicon Carbide (SiC) MOSFETs for traction applications. His recent work includes analyzing the performance of sintered silver for die attachment under high temperatures and strain rates, and exploring direct cooling methods for high voltage power electronics through dielectric fluid microchannel embedded terminals. Nafis has published 15 papers, accumulating 200 citations and an h-index of 5. He collaborates with researchers including David Huitink, Mohammad Hazzaz Mahmud, Yuxiang Chen, and Ange-Christian Iradukunda, all from the University of Arkansas at Fayetteville, with whom he has co-authored multiple publications. His recent publications date to 2024, indicating ongoing activity in his research areas.
Metrics
- h-index: 5
- Publications: 15
- Citations: 202
Selected Publications
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Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
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Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024)
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System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile (2021)
Collaboration Network
Top Collaborators
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for Sic Mosfet Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for Sic Mosfet Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for Sic Mosfet Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for Sic Mosfet Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for Sic Mosfet Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
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