Match tier Likely match
Presence Not recently confirmed
Last published 2024
Sources OpenAlex · ORCID
Refreshed 2026-10-07

Bakhtiyar Mohammad Nafis

This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.

Role not yet determined Is this you? Add your title

Also affiliated: Bangladesh University of Engineering and Technology (2017)

6 h-index 15 pubs 207 cited

Biography and Research Information

OverviewAI-generated summary

Bakhtiyar Mohammad Nafis's research focuses on thermal management and reliability in electronic systems, particularly for power electronics and automotive applications. He has investigated methods to enhance thermal dissipation through additive manufacturing for heat sinks and heat spreaders, examining materials like polymers and exploring their heat transfer and pressure drop performance. His work also addresses the thermal design requirements and reliability implications of electric vehicle traction drive inverters, considering drive schedule impacts. Additionally, Nafis has studied the design and evaluation of semiconductor-based power electronic building blocks (PEBBs) for aircraft motor driving and explored direct cooling techniques using dielectric fluids in microchannels for high-voltage power electronics. His scholarship includes 15 publications with an h-index of 6 and 207 citations. He has collaborated with researchers at the University of Arkansas at Fayetteville, including David Huitink, Mohammad Hazzaz Mahmud, Kevin Chen, and Ange-Christian Iradukunda.

Metrics

  • h-index: 6
  • Publications: 15
  • Citations: 207

Selected Publications

  • Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
    3 citations DOI OpenAlex
  • Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024)
    IEEE Transactions on Components Packaging and Manufacturing Technology 5 citations DOI OpenAlex
  • System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile (2021)
    Journal of Electronic Packaging 3 citations DOI OpenAlex
  • System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application (2020)
  • Accelerated mechanical low cycle fatigue in isothermal solder interconnects (2020)
    Microelectronics Reliability 9 citations DOI OpenAlex
  • System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials (2020)
    Journal of Electronic Packaging 13 citations DOI OpenAlex
  • Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review (2020)
    Heat Transfer Engineering 109 citations DOI OpenAlex
  • Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization (2019)
    5 citations DOI OpenAlex
  • System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles (2019)
    1 citation DOI OpenAlex
  • Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application (2019)
    37 citations DOI OpenAlex
  • Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics (2019)
    13 citations DOI OpenAlex
  • Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters (2018)
    4 citations DOI OpenAlex

View all publications on OpenAlex →

Collaboration Network

26 Collaborators 3 Institutions 1 Country

Top Collaborators

View profile →
View profile →
View profile →
View profile →
View profile →
View profile →

Similar Researchers

Based on overlapping research topics