Bakhtiyar Mohammad Nafis
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Also affiliated: Bangladesh University of Engineering and Technology (2017)
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Biography and Research Information
OverviewAI-generated summary
Bakhtiyar Mohammad Nafis's research focuses on thermal management and reliability in electronic systems, particularly for power electronics and automotive applications. He has investigated methods to enhance thermal dissipation through additive manufacturing for heat sinks and heat spreaders, examining materials like polymers and exploring their heat transfer and pressure drop performance. His work also addresses the thermal design requirements and reliability implications of electric vehicle traction drive inverters, considering drive schedule impacts. Additionally, Nafis has studied the design and evaluation of semiconductor-based power electronic building blocks (PEBBs) for aircraft motor driving and explored direct cooling techniques using dielectric fluids in microchannels for high-voltage power electronics. His scholarship includes 15 publications with an h-index of 6 and 207 citations. He has collaborated with researchers at the University of Arkansas at Fayetteville, including David Huitink, Mohammad Hazzaz Mahmud, Kevin Chen, and Ange-Christian Iradukunda.
Metrics
- h-index: 6
- Publications: 15
- Citations: 207
Selected Publications
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Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
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Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024)
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System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile (2021)
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System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application (2020)
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Accelerated mechanical low cycle fatigue in isothermal solder interconnects (2020)
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System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials (2020)
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Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review (2020)
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Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization (2019)
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System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles (2019)
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Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application (2019)
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Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics (2019)
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Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters (2018)
Collaboration Network
Top Collaborators
- Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
- Accelerated mechanical low cycle fatigue in isothermal solder interconnects
Showing 5 of 12 shared publications
- Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
- Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review
- System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
- Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles
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