Match tier
Likely match
Presence
Current · Arkansas
Last published
2026
Sources
OpenAlex · ORCID
Refreshed
2026-10-08
E
Ethan Weems
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
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3 h-index
9 pubs
54 cited
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Ethan Weems investigates methods for nonintrusive heat flux quantification, particularly utilizing acoustic emissions during pool boiling processes. His work also extends to the development of cooling systems for power electronics, including two-phase immersion coolers and lightweight hybrid liquid coolers designed for medium-voltage silicon carbide MOSFETs. Weems has published on remote thermal measurements derived from acoustic emissions and has also contributed to research on coupled field-driven design and numerical simulation within engineering education. His scholarly activity includes 9 publications with 53 citations and an h-index of 3. Weems collaborates with several researchers at the University of Arkansas at Fayetteville, including Han Hu (7 shared publications), Christy Dunlap (4 shared publications), and Qiang Wu (3 shared publications).
Metrics
- h-index: 3
- Publications: 9
- Citations: 54
Selected Publications
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Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module (2026)
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Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module (2026)
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Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates (2024)
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Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs (2024)
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Coupled Field-Driven Design and Numerical Simulation for Engineering Education (2024)
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Remote Thermal Measurements With Regression of Acoustic Emissions (2023)
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Nonintrusive heat flux quantification using acoustic emissions during pool boiling (2023)
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Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling (2022)
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Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling (2022)
Collaboration Network
Top Collaborators
Han Hu
University of Arkansas at Fayetteville
7 shared publications
In database
- Nonintrusive heat flux quantification using acoustic emissions during pool boiling
- Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling
- Remote Thermal Measurements With Regression of Acoustic Emissions
- Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs
- Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling
Showing 5 of 7 shared publications
Hari Pandey
University of Arkansas at Fayetteville (US)
6 shared publications
- Nonintrusive heat flux quantification using acoustic emissions during pool boiling
- Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling
- Remote Thermal Measurements With Regression of Acoustic Emissions
- Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs
- Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling
Showing 5 of 6 shared publications
Christy Dunlap
University of Arkansas at Fayetteville
4 shared publications
In database
- Nonintrusive heat flux quantification using acoustic emissions during pool boiling
- Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling
- Remote Thermal Measurements With Regression of Acoustic Emissions
- Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling
Xiaoling Li
University of Arkansas at Fayetteville
3 shared publications
In database
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
- Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module
- Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module
Stephen Pierson
University of Arkansas at Fayetteville
2 shared publications
In database
- Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
Stephen Pierson
University of Arkansas at Fayetteville
2 shared publications
In database
- Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module
- Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module
H. Alan Mantooth
University of Arkansas at Fayetteville
2 shared publications
In database
- Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module
- Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module
Jackson Marsh
University of Arkansas at Fayetteville
1 shared publication
In database
- Remote Thermal Measurements With Regression of Acoustic Emissions
Xinyuan Du
University of Arkansas at Fayetteville
1 shared publication
In database
- Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs
Ahmad Al-Hmoud
University of Arkansas at Fayetteville (US)
1 shared publication
- Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs
Yue Zhao
University of Arkansas at Fayetteville
1 shared publication
In database
- Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs
Qiang Wu
University of Arkansas at Fayetteville
1 shared publication
In database
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
Sudharsan Chinnaiyan
University of Arkansas at Fayetteville
1 shared publication
In database
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
Yuxiang Chen
University of Arkansas at Fayetteville
1 shared publication
In database
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
Han Hu
University of Arkansas at Fayetteville
1 shared publication
In database
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
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