Qiang Wu
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Also affiliated: Florida State University (2014–2023); University of Science and Technology of China (2021–2023); Shanghai Jiao Tong University (2022); Shanghai University of Electric Power (2023); Guangxi Normal University (2022–2024); Suzhou Research Institute (2024–2025); State Key Laboratory of Mechanical System and Vibration (2022); Zhejiang University (2008); Florida Agricultural and Mechanical University (2014); Beihang University (2009)
Research Areas
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Biography and Research Information
OverviewAI-generated summary
Qiang Wu's research interests lie in the intersection of materials science and energy systems, with a particular focus on battery technologies and photovoltaic systems. His work includes the investigation of electrochemical behaviors in high-capacity electrodes and the development of methods for accurately estimating the state of charge in lithium-ion batteries, especially under high-rate charging conditions. Wu has also explored techniques for assessing tool wear using machine learning and investigated methods to improve the accuracy of insulation resistance measurements in battery packs. His publications extend to the prediction of electric load and photovoltaic solar power in grid-connected systems, as well as reviews on energy management optimization for hybrid power systems.
Wu has a publication record of 23 papers, with an h-index of 11 and 339 citations. He has collaborated with several researchers at the University of Arkansas at Fayetteville, including Sudharsan Chinnaiyan, Mohammad Dehan Rahman, Ethan Weems, and Zuhuang Chen, on multiple shared publications.
Metrics
- h-index: 11
- Publications: 23
- Citations: 339
Selected Publications
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Automated Near-Field EMI Scanning System Using Robotic Arm for Wide-Bandgap-Based Power Converters (2026)
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Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module (2026)
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Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module (2026)
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Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions (2026)
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Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules (2025)
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A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules (2025)
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Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers (2025)
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Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates (2024)
Collaboration Network
Top Collaborators
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
- A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
- A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
- Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module
- Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules
- Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module
- Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module
- Automated Near-Field EMI Scanning System Using Robotic Arm for Wide-Bandgap-Based Power Converters
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules
- Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules
- Automated Near-Field EMI Scanning System Using Robotic Arm for Wide-Bandgap-Based Power Converters
- Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module
- Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
- Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates
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