Match tier
Confirmed
Presence
Current · Arkansas
Last published
2026
Sources
OpenAlex · ORCID
Refreshed
2026-10-05
D
David Ryan Huitink
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
High Impact
Associate Professor
Also affiliated: Intel (United States) (2012–2015); Texas A&M University System (2013); Texas A&M University (2007–2013)
21 h-index
176 pubs
1,531 cited
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
David Ryan Huitink's research investigates the design and application of novel materials and devices for thermal management and drug delivery. His work includes the review of advanced thermal management solutions for high-voltage packages and additive manufacturing for heat sink implementation. He has also studied the transient thermal performance of heat sinks integrated with phase change materials and explored failure mechanism reliability models for power electronics.
Huitink's research also extends to biomedical applications, including the design and characterization of chitosan microneedle patches for the transdermal delivery of meloxicam, particularly for use in cattle. His prior work has involved the photoinduced formation of electrically conductive thin palladium nanowires on DNA scaffolds and the development of procedures for analyzing nanoparticle morphology.
With an h-index of 21 and over 1,500 citations across 171 publications, Huitink is recognized as a highly cited researcher. He collaborates with several researchers at the University of Arkansas at Fayetteville, including Whit Vinson, Muhammad Ghufran, Alexis Krone, and Reece Whitt, with whom he shares multiple publications. Huitink maintains an active laboratory website.
Metrics
- h-index: 21
- Publications: 176
- Citations: 1,531
Positions
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Associate Professor 2022–presentUniversity of Arkansas Department of Mechanical Engineering ORCID
Selected Publications
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Design of a Full-Bridge Power Module for a Dual Active Bridge Converter (2026)
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Dielectric Breakdown Behavior in Vapor Phase Dielectric Fluids: Understanding Voltage Isolation in Direct Immersion Power Electronics (2026)
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Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic Systems (2026)
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Modified tumor uptake and biodistribution of nanoparticles coated with small extracellular vesicle membranes derived from distinct tumor cell lines (2026)
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Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling (2026)
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Failure Mode Progression Driven by Thermal-Electric Stressors in Aluminum Wire Bonds (2026)
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Development and Evaluation of Novel Eutectic PCMs for Thermal Management Applications (2025)
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Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL Tool (2025)
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A High Temperature LTCC Based Packaging Scheme for Power Electronics (2025)
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A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior (2025)
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Experimental Investigation of Heat Transfer Characteristics of an Impinging Air Jet for Cooling a High-Voltage Silicon Carbide Module (2025)
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Compact Busbar Design Strategy for a 100 kW, 300 kHz Dual Active Bridge Converter Topology (2025)
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Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C (2025)
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Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method (2025)
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Addition of Thermal Energy Storage to Thermal Interface Materials Using Dispersed Encapsulated Phase Change Materials (2025)
Collaboration Network
Top Collaborators
Hayden Carlton
Johns Hopkins University (US)
19 shared publications
- Design, characterization, and modeling of a chitosan microneedle patch for transdermal delivery of meloxicam as a pain management strategy for use in cattle
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- Tribochemistry as an Alternative Synthesis Pathway
- Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
- Effect of Cu nanoparticles on the tribological performance of polydopamine + polytetrafluoroethylene coatings in oil-lubricated condition
Showing 5 of 19 shared publications
Fang Luo
Stony Brook University (US)
16 shared publications
- A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications
Showing 5 of 16 shared publications
Reece Whitt
University of Arkansas at Fayetteville
14 shared publications
In database
- Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Showing 5 of 14 shared publications
Whit Vinson
University of Arkansas at Fayetteville
14 shared publications
In database
- Mechanical stress state consideration for enhanced electromigration life prediction in aluminum wire bonds
- Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
- Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization
- Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
Showing 5 of 14 shared publications
Ange-Christian Iradukunda
University of Arkansas at Fayetteville
13 shared publications
In database
- A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages
- Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review
- Transient thermal performance using phase change material integrated topology optimized heat sinks
- A Tutorial on High-Density Power Module Packaging
- System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Showing 5 of 13 shared publications
John Harris
University of Arkansas at Fayetteville (US)
13 shared publications
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Thermal stability study of gallium nitride based magnetic field sensor
- Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
Showing 5 of 13 shared publications
H. Alan Mantooth
University of Arkansas at Fayetteville
13 shared publications
In database
- A Tutorial on High-Density Power Module Packaging
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- Thermal stability study of gallium nitride based magnetic field sensor
- A Partial Discharge Inception Voltage Modeling Approach
- Automated Layout Optimization Methods of a Bidirectional DC-DC ZVS Converter Using PowerSynth
Showing 5 of 13 shared publications
Mahsa Montazeri
University of Arkansas at Fayetteville
12 shared publications
In database
- Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability
- Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
- Direct cooling of a planar magnetic converter using dielectric liquid forced convection enabled by additive manufacturing
- Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
- Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
Showing 5 of 12 shared publications
Bakhtiyar Mohammad Nafis
University of Arkansas at Fayetteville
12 shared publications
In database
- Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
- Accelerated mechanical low cycle fatigue in isothermal solder interconnects
Showing 5 of 12 shared publications
Muhammad Ghufran
University of Arkansas at Fayetteville
11 shared publications
In database
- Synthesis of nano-size paraffin/silica-based encapsulated phase change materials of high encapsulation ratio via sol–gel method
- Synthesis and thermal performance of nano-sized paraffin-based titania encapsulated PCMs via sol–gel method
- Advances in encapsulated phase change materials for integration in thermal management applications
- Synthesis of silica-encapsulated myristic acid phase-change-assisted nanocapsules for thermal management applications
- Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
Showing 5 of 11 shared publications
Joshua Kasitz
University of Arkansas at Fayetteville
9 shared publications
In database
- Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
- Nanoparticle Enhanced Crystallization of Sorbitol PCMs for Latent Heat and Temperature Control
- Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
- Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability
- Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives
Showing 5 of 9 shared publications
Alan Mantooth
University of Arkansas at Fayetteville
8 shared publications
In database
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
- Fabrication Process Optimization of A High- Power Double-Sided Cooled SiC Power Module
- Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
Showing 5 of 8 shared publications
Zhao Yuan
University of Arkansas at Fayetteville (US)
8 shared publications
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications
- Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
- Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
Showing 5 of 8 shared publications
Asif Imran Emon
Stony Brook University (US)
8 shared publications
- Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application
- Thermal and Electrical Performance in High-Voltage Power Modules With Nonmetallic Additively Manufactured Impingement Coolers
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications
- Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Showing 5 of 8 shared publications
Alexis Krone
University of Arkansas at Fayetteville
7 shared publications
In database
- Design and Optimization of Gate Driver Integrated Multichip 3-D GaN Power Module
- A 650V/60A Gate Driver Integrated Wire-bondless Multichip GaN Module
- Design and Optimization of 650V/60A Double-Sided Cooled Multichip GaN Module
- Thermal stability study of gallium nitride based magnetic field sensor
- High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
Showing 5 of 7 shared publications
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