Bakhtiyar Mohammad Nafis
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Researcher
Also affiliated: Bangladesh University of Engineering and Technology (2017)
Faculty Researcher
Research Areas
Links
Biography and Research Information
OverviewAI-generated summary
Bakhtiyar Mohammad Nafis, a faculty member at the University of Arkansas at Fayetteville, investigates the reliability and risk assessment of power electronic systems, particularly those utilizing Silicon Carbide (SiC) MOSFETs for traction applications. His recent work includes analyzing the performance of sintered silver for die attachment under high temperatures and strain rates, and exploring direct cooling methods for high voltage power electronics through dielectric fluid microchannel embedded terminals. Nafis has published 15 papers, accumulating 200 citations and an h-index of 5. He collaborates with researchers including David Huitink, Mohammad Hazzaz Mahmud, Yuxiang Chen, and Ange-Christian Iradukunda, all from the University of Arkansas at Fayetteville, with whom he has co-authored multiple publications. His recent publications date to 2024, indicating ongoing activity in his research areas.
Metrics
- h-index: 5
- Publications: 15
- Citations: 206
Selected Publications
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Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
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Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024)
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System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile (2021)
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System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application (2020)
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Accelerated mechanical low cycle fatigue in isothermal solder interconnects (2020)
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System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials (2020)
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Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review (2020)
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Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization (2019)
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System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles (2019)
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Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application (2019)
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Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics (2019)
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Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters (2018)
Collaboration Network
Top Collaborators
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
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