Match tier Likely match
Presence Current · Arkansas
Last published 2024
Sources OpenAlex · ORCID
Refreshed 2026-08-15

Bakhtiyar Mohammad Nafis

This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.

Researcher

Also affiliated: Bangladesh University of Engineering and Technology (2017)

Faculty Researcher

5 h-index 15 pubs 206 cited

Biography and Research Information

OverviewAI-generated summary

Bakhtiyar Mohammad Nafis, a faculty member at the University of Arkansas at Fayetteville, investigates the reliability and risk assessment of power electronic systems, particularly those utilizing Silicon Carbide (SiC) MOSFETs for traction applications. His recent work includes analyzing the performance of sintered silver for die attachment under high temperatures and strain rates, and exploring direct cooling methods for high voltage power electronics through dielectric fluid microchannel embedded terminals. Nafis has published 15 papers, accumulating 200 citations and an h-index of 5. He collaborates with researchers including David Huitink, Mohammad Hazzaz Mahmud, Yuxiang Chen, and Ange-Christian Iradukunda, all from the University of Arkansas at Fayetteville, with whom he has co-authored multiple publications. His recent publications date to 2024, indicating ongoing activity in his research areas.

Metrics

  • h-index: 5
  • Publications: 15
  • Citations: 206

Selected Publications

  • Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
    3 citations DOI OpenAlex
  • Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal (2024)
    IEEE Transactions on Components Packaging and Manufacturing Technology 5 citations DOI OpenAlex
  • System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile (2021)
    Journal of Electronic Packaging 3 citations DOI OpenAlex
  • System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application (2020)
  • Accelerated mechanical low cycle fatigue in isothermal solder interconnects (2020)
    Microelectronics Reliability 9 citations DOI OpenAlex
  • System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials (2020)
    Journal of Electronic Packaging 13 citations DOI OpenAlex
  • Additive Manufacturing for Enhancing Thermal Dissipation in Heat Sink Implementation: A Review (2020)
    Heat Transfer Engineering 109 citations DOI OpenAlex
  • Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization (2019)
    5 citations DOI OpenAlex
  • System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles (2019)
    1 citation DOI OpenAlex
  • Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application (2019)
    35 citations DOI OpenAlex
  • Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics (2019)
    13 citations DOI OpenAlex
  • Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters (2018)
    4 citations DOI OpenAlex

View all publications on OpenAlex →

Collaboration Network

11 Collaborators 2 Institutions 1 Country

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