Match tier
Listed
Presence
Current · Arkansas
Last published
2026
Sources
OpenAlex · ORCID
Refreshed
2026-10-01
S
Research Areas
Biography and Research Information
OverviewAI-generated summary
Saroj Majakoti's research focuses on the reliability and performance of materials used in electronic packaging, particularly at high temperatures and strain rates. His work investigates die attachment materials, evaluating their fatigue performance beyond 175°C. Majakoti employs techniques such as four-point cyclic isothermal bend tests and nanoindentation combined with inverse finite element modeling to understand the elasto-plastic behavior of these materials. He also studies methods for predicting junction temperature in power modules to estimate thermal resistance, utilizing real-time monitoring techniques. His research includes an investigation into deformation processes of rolled aluminum sheets using instrumented indentation. Majakoti has 6 publications with an h-index of 1 and has collaborated with researchers including Ekene Gabriel Okafor and David Huitink at the University of Arkansas at Fayetteville.
Metrics
- h-index: 1
- Publications: 6
- Citations: 3
Selected Publications
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Design of a Full-Bridge Power Module for a Dual Active Bridge Converter (2026)
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A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior (2025)
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Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C (2025)
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Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method (2025)
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Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation (2025)
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Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
Collaboration Network
Top Collaborators
David Ryan Huitink
University of Arkansas at Fayetteville
4 shared publications
In database
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
- Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C
- A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior
Santosh Thapa
University of Kentucky (US)
2 shared publications
- Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation
- A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior
Yang‐Tse Cheng
University of Kentucky (US)
2 shared publications
- Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation
- A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior
Ekene Gabriel Okafor
University of Arkansas at Fayetteville
2 shared publications
In database
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
- Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C
Liyang Du
University of Arkansas at Fayetteville
2 shared publications
In database
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
Bakhtiyar Mohammad Nafis
University of Arkansas at Fayetteville
1 shared publication
In database
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
Madhav Baral
University of Kentucky (US)
1 shared publication
- Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation
Homer Alan Mantooth
University of Arkansas at Fayetteville
1 shared publication
In database
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
Weiping Fu
University of Arkansas at Fayetteville
1 shared publication
In database
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
Xiaoling Li
University of Arkansas at Fayetteville
1 shared publication
In database
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
Yuxiang Chen
University of Arkansas at Fayetteville
1 shared publication
In database
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
Alan Mantooth
University of Arkansas at Fayetteville
1 shared publication
In database
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
David Huitink
University of Arkansas at Fayetteville
1 shared publication
In database
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
David Underwood
Micro Cooling Concepts (United States) (US)
1 shared publication
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
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