Biography and Research Information
OverviewAI-generated summary
Saroj Majakoti's research focuses on the reliability and performance of materials used in high-temperature electronic component attachments. His work investigates the elasto-plastic behavior of materials through nanoindentation and inverse finite element modeling, particularly at temperatures exceeding 175°C. Majakoti has published studies evaluating the fatigue performance and reliability of sintered silver (S-Ag) die attachments using cyclic isothermal bend tests. He also explores methods for predicting junction temperatures and thermal resistance in semiconductor power modules, such as those utilizing Silicon Carbide (SiC).
Majakoti's collaborations at the University of Arkansas at Fayetteville include work with Ekene Gabriel Okafor, David Huitink, Bakhtiyar Mohammad Nafis, and Liyang Du. His research has contributed to understanding deformation processes in materials like rolled aluminum sheets through instrumented indentation techniques.
Metrics
- h-index: 1
- Publications: 5
- Citations: 3
Selected Publications
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A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior (2025)
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Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C (2025)
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Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method (2025)
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Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation (2025)
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Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates (2024)
Collaboration Network
Top Collaborators
David Huitink
University of Arkansas at Fayetteville
4 shared publications
In database
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
- Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C
- A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior
Santosh Thapa
University of Kentucky (US)
2 shared publications
- Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation
- A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior
Yang‐Tse Cheng
University of Kentucky (US)
2 shared publications
- Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation
- A Nanoindentation and Inverse Finite Element Modeling-Based Study of High Temperature Attachment Material for Obtaining Elasto-Plastic Behavior
Ekene Gabriel Okafor
University of Arkansas at Fayetteville
2 shared publications
In database
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
- Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C
Bakhtiyar Mohammad Nafis
University of Arkansas at Fayetteville
1 shared publication
In database
- Reliability Analysis of Sintered Silver (S-Ag) for Die Attachment Using a Four-Point Cyclic Isothermal Bend Test Approach at High Temperature and Strain Rates
Madhav Baral
University of Kentucky (US)
1 shared publication
- Understanding Deformation Processes of a Rolled Aluminum Sheet Using Instrumented Indentation
Liyang Du
University of Arkansas at Fayetteville
1 shared publication
In database
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
H. Alan Mantooth
University of Arkansas at Fayetteville
1 shared publication
In database
- Prediction of Junction Temperature to Estimate Thermal Resistance in 1.7kV SiC Power Module using Real-time Vsd Monitoring Method
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