Match tier
Likely match
Presence
Current · Arkansas
Last published
2026
Sources
OpenAlex · ORCID
Refreshed
2026-08-15
W
Whit Vinson
This is a likely match — the affiliation was inferred from OpenAlex, ORCID, and web sources but has not been fully confirmed. Treat with appropriate caution.
Researcher
Faculty Researcher
4 h-index
14 pubs
37 cited
Research Areas
Biomedical Subjects
Biography and Research Information
OverviewAI-generated summary
Whit Vinson's research focuses on the reliability and failure mechanisms of electronic components, particularly in demanding environments. His work investigates how mechanical stress states, such as those induced by electromigration and strain, impact the predicted lifespan of aluminum wire bonds and solder interconnects. Vinson has explored methods to enhance electromigration life prediction by incorporating tensile stress and analyzing stress interactions, utilizing techniques like particle swarm optimization for accelerated life test plan development. His publications also address reliability optimization for microelectronic packaging layouts and the development of combined electromigration and strain accelerated failure tests, with applications to grid-tied solar inverters and extreme environment power modules. Vinson's scholarly contributions include 14 publications, with an h-index of 4 and 34 total citations. He has collaborated extensively with David Huitink, François Torrès, and Yarui Peng, all from the University of Arkansas at Fayetteville.
Metrics
- h-index: 4
- Publications: 14
- Citations: 37
Selected Publications
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Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic Systems (2026)
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Modified tumor uptake and biodistribution of nanoparticles coated with small extracellular vesicle membranes derived from distinct tumor cell lines (2026)
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Failure Mode Progression Driven by Thermal-Electric Stressors in Aluminum Wire Bonds (2026)
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Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL Tool (2025)
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Electromigration in Eutectic Gold-Tin (80Au20Sn-wt%) Solder Joints (2025)
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Examining Wire Bond Coatings for Application in High Power Density Systems (2025)
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Comparing Wire Bonding Strategies for High Power Applications (2024)
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Altering Electromigration Response in Aluminum Wire Bonds through Heat Treatment (2024)
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Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints (2024)
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Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules (2023)
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Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing (2023)
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Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules (2023)
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Mechanical stress state consideration for enhanced electromigration life prediction in aluminum wire bonds (2023)
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Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization (2023)
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Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth (2022)
Collaboration Network
Top Collaborators
David Huitink
University of Arkansas at Fayetteville
14 shared publications
In database
- Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
- Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization
- Mechanical stress state consideration for enhanced electromigration life prediction in aluminum wire bonds
- Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
Showing 5 of 14 shared publications
Imam Al Razi
University of Arkansas at Fayetteville
3 shared publications
In database
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Yarui Peng
University of Arkansas at Fayetteville
3 shared publications
In database
- Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Collin Ruby
University of Arkansas at Fayetteville
2 shared publications
In database
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
David Agogo-Mawuli
University of Arkansas at Fayetteville
2 shared publications
In database
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Alan Mantooth
University of Arkansas at Fayetteville
2 shared publications
In database
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Ange Iradukunda
University of Arkansas at Fayetteville (US)
1 shared publication
- Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
Jong-Pil Lee
Korea Electrotechnology Research Institute (KR)
1 shared publication
- Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
Minho Kwon
Korea Electrotechnology Research Institute (KR)
1 shared publication
- Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
Chang-Yeol Oh
Korea Electrotechnology Research Institute (KR)
1 shared publication
- Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
Mahsa Montazeri
University of Arkansas at Fayetteville
1 shared publication
In database
- Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
Ekene Gabriel Okafor
University of Arkansas at Fayetteville
1 shared publication
In database
- Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization
Kevin Velasquez Carballo
University of Arkansas at Fayetteville
1 shared publication
In database
- Examining Wire Bond Coatings for Application in High Power Density Systems
Xiangbo Meng
University of Arkansas at Fayetteville
1 shared publication
In database
- Examining Wire Bond Coatings for Application in High Power Density Systems
David Agogo-Mawuli
University of Arkansas at Fayetteville
1 shared publication
In database
- Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL Tool
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