Xiaoling Li
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Research Engineer
Also affiliated: Qinghai University (2021); National Laboratory of the Rockies (2024–2025); IHI Corporation (United States) (2004); Xinyang Normal University (2015); Beijing University of Posts and Telecommunications (2007); Nanchang University (2019); Shandong University (2025); Chongqing University (2017–2019); Liaoning Shihua University (2015); Nanjing Forestry University (2023); National University of Defense Technology (2024); Shanghai Jiao Tong University (2004–2016); Northeast Normal University (2022); Agricultural Bank of China (2009); Peking University (2009); Harbin Institute of Technology (2010–2014); Purdue University West Lafayette (2014); Chang'an University (2022); China University of Mining and Technology (2014); Guilin University of Technology (2020–2021); Shangluo University (2011); Panzhihua University (2008); Hunan Nonferrous Metal Research Institute (2010); Hexi University (2005–2006); Heilongjiang Provincial Hospital (2024); Ningxia Water Conservancy (2007); Advanced Power Electronics (United States) (2025); Henan Institute of Science and Technology (2011); Dezhou University (2006); University of Maryland, College Park (2006); Fuzhou University (2018); Northwest A&F University (2023); South China University of Technology (2023); Taiyuan University of Technology (2022); Northeastern University (2018)
Faculty Researcher
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
Xiaoling Li's research investigates advancements in semiconductor devices and materials, particularly focusing on silicon carbide (SiC) MOSFET power modules. Her work includes optimizing system interfaces, electric field distribution, and electromagnetic interference (EMI) mitigation in high-voltage power modules. Li has explored double-sided cooling designs for SiC MOSFET modules intended for electric vehicle inverters and studied the tight integration of low-inductance SiC power modules with microchannel coolers.
Beyond power electronics, Li has contributed to research on novel solvent systems for carbon dioxide capture, addressing energy penalties and corrosion. Her publications also touch upon the structural resilience of global oil and gas resource trade networks and the synthesis of materials for sodium-ion batteries. Li's scholarly output is reflected in an h-index of 20, with 94 total publications and 1,296 citations. She has a history of collaboration with researchers at the University of Arkansas at Fayetteville, including Kevin Chen, H. Alan Mantooth, Sudharsan Chinnaiyan, and Yue Zhao.
Metrics
- h-index: 20
- Publications: 94
- Citations: 1,302
Selected Publications
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Design of a Full-Bridge Power Module for a Dual Active Bridge Converter (2026)
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Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module (2026)
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Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module (2026)
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Design and Characterization of 1.2 kV Optically Isolated Half-Bridge Modules for High Temperature Operation (2024)
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Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates (2024)
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Thermal and Bonding Strength Evaluation of Die Attach Materials for Power Module Packaging (2024)
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Impact of 6.5-kV SiC MOSFET Gate Bias on Reverse Recovery Over a Wide Temperature Range (2024)
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A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters (2024)
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A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution (2024)
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Design and Surface Flashover Test of 10 kV SiC Power Module for DC Shipboard Application (2023)
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Demonstration and Optimization of a 250°C LTCC-based Gate Driver for High Density, High-Temperature Power Modules (2023)
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3.3 kV Low-Inductance Full SiC Power Module (2023)
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Single Current Measurement Based Bidirectional Frequency Tracking for Unregulated Series Resonant Dab Converters (2023)
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Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler (2023)
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A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction (2023)
Collaboration Network
Top Collaborators
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- 3.3 kV Low-Inductance Full SiC Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
Showing 5 of 14 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- 3.3 kV Low-Inductance Full SiC Power Module
Showing 5 of 11 shared publications
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- 3.3 kV Low-Inductance Full SiC Power Module
Showing 5 of 8 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- 3.3 kV Low-Inductance Full SiC Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
Showing 5 of 8 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- 3.3 kV Low-Inductance Full SiC Power Module
- A Novel Integrated 1.2 kV Double-sided Cooled Power Module
Showing 5 of 7 shared publications
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- 3.3 kV Low-Inductance Full SiC Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Demonstration and Optimization of a 250°C LTCC-based Gate Driver for High Density, High-Temperature Power Modules
- Design and Characterization of 1.2 kV Optically Isolated Half-Bridge Modules for High Temperature Operation
Showing 5 of 6 shared publications
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- Design and Surface Flashover Test of 10 kV SiC Power Module for DC Shipboard Application
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
- Thermal and Bonding Strength Evaluation of Die Attach Materials for Power Module Packaging
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- 3.3 kV Low-Inductance Full SiC Power Module
- Single Current Measurement Based Bidirectional Frequency Tracking for Unregulated Series Resonant Dab Converters
- Heterotypic Current Transformer Design for Overcurrent Protection of SiC MOSFET
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A Novel Integrated 1.2 kV Double-sided Cooled Power Module
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