Xiaoling Li
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Research Engineer
Also affiliated: Qinghai University (2021); National Laboratory of the Rockies (2024–2025); Xinyang Normal University (2015); Beijing University of Posts and Telecommunications (2007); Nanchang University (2019); Shandong University (2024–2025); Chongqing University (2017–2019); Liaoning Shihua University (2015); Nanjing Forestry University (2023); National University of Defense Technology (2024); Shanghai Jiao Tong University (2004–2016); Northeast Normal University (2022); Harbin Institute of Technology (2010–2014); Chang'an University (2022); China University of Mining and Technology (2014); Guilin University of Technology (2020–2021); Shandong Management University (2024); Shangluo University (2011); Panzhihua University (2008); Research Institute of Petroleum Exploration and Development (2012); Hexi University (2005–2006); Henan Institute of Science and Technology (2011); State Key Laboratory of Metal Matrix Composites (2016); State Key Laboratory of Urban Water Resources and Water Environment (2014); Guangxi Key Laboratory of Environmental Pollution Control Theory and Technology (2020–2021); University of Maryland, College Park (2006); Fuzhou University (2018); Northwest A&F University (2023); South China University of Technology (2023); Taiyuan University of Technology (2022); Northeastern University (2018)
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
Xiaoling Li's research has explored diverse areas, including the impact of temperature on sludge fermentation and the development of novel solvents for carbon dioxide capture. Her work on sludge fermentation investigated the accumulation of short-chain fatty acids and microbiological transformations under alkaline conditions using calcium hydroxide. In the realm of carbon capture, Li has focused on nonaqueous biphasic solvent systems, including a monoethanolamine-based solvent, designed to reduce energy penalties and corrosivity, contributing to more efficient CO2 capture technologies.
Her research also extends to semiconductor device engineering, with publications on gate drivers for SiC MOSFETs and power modules, as well as reliability simulation methods for CMOS VLSI circuits. Additionally, Li has examined the structural resilience of global oil and gas resource trade networks. Her scholarly output includes 90 publications with 1,328 citations and an h-index of 20. She has a significant record of collaboration with researchers at the University of Arkansas at Fayetteville, including Kevin Chen (11 shared publications), H. Alan Mantooth (8 shared publications), Sudharsan Chinnaiyan (6 shared publications), and Yue Zhao (5 shared publications).
Metrics
- h-index: 20
- Publications: 88
- Citations: 1,331
Positions
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Research Engineer 2024–presentNREL Center for Energy Conversion and Storage Systems ORCID
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Research Engineer publications 2020–2026University of Arkansas at Fayetteville ORCID
Selected Publications
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Design of a Full-Bridge Power Module for a Dual Active Bridge Converter (2026)
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Lightweight Hybrid Additively Manufactured Liquid Cooler for 10 kV SiC MOSFET Power Module (2026)
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Data from: Additively manufactured lightweight hybrid multi-tier liquid cooler for 10 kV SiC MOSFET power module (2026)
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Design and Characterization of 1.2 kV Optically Isolated Half-Bridge Modules for High Temperature Operation (2024)
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Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates (2024)
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Thermal and Bonding Strength Evaluation of Die Attach Materials for Power Module Packaging (2024)
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Impact of 6.5-kV SiC MOSFET Gate Bias on Reverse Recovery Over a Wide Temperature Range (2024)
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A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters (2024)
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A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution (2024)
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Design and Surface Flashover Test of 10 kV SiC Power Module for DC Shipboard Application (2023)
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Demonstration and Optimization of a 250°C LTCC-based Gate Driver for High Density, High-Temperature Power Modules (2023)
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3.3 kV Low-Inductance Full SiC Power Module (2023)
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Single Current Measurement Based Bidirectional Frequency Tracking for Unregulated Series Resonant Dab Converters (2023)
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Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler (2023)
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A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction (2023)
Collaboration Network
Top Collaborators
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- Design and Optimization of SiC MOSFET Wire Bondless Power Modules
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- 3.3 kV Low-Inductance Full SiC Power Module
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
Showing 5 of 15 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- Design and Optimization of SiC MOSFET Wire Bondless Power Modules
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
Showing 5 of 12 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- Design and Optimization of SiC MOSFET Wire Bondless Power Modules
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- 3.3 kV Low-Inductance Full SiC Power Module
Showing 5 of 9 shared publications
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- 3.3 kV Low-Inductance Full SiC Power Module
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
Showing 5 of 8 shared publications
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- 3.3 kV Low-Inductance Full SiC Power Module
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- A Novel Integrated 1.2 kV Double-sided Cooled Power Module
Showing 5 of 7 shared publications
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- 3.3 kV Low-Inductance Full SiC Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Demonstration and Optimization of a 250°C LTCC-based Gate Driver for High Density, High-Temperature Power Modules
- Design and Characterization of 1.2 kV Optically Isolated Half-Bridge Modules for High Temperature Operation
Showing 5 of 6 shared publications
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- Design and Surface Flashover Test of 10 kV SiC Power Module for DC Shipboard Application
- 3.3 kV Low-Inductance Full SiC Power Module
- Single Current Measurement Based Bidirectional Frequency Tracking for Unregulated Series Resonant Dab Converters
- Heterotypic Current Transformer Design for Overcurrent Protection of SiC MOSFET
- Design of a Full-Bridge Power Module for a Dual Active Bridge Converter
- A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution
- A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
- Thermal and Bonding Strength Evaluation of Die Attach Materials for Power Module Packaging
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler
- Design and Optimization of SiC MOSFET Wire Bondless Power Modules
- Demonstration and Optimization of a 250°C LTCC-based Gate Driver for High Density, High-Temperature Power Modules
- High Voltage SiC Power Module Optimized for Low Parasitics and Compatible System Interface
- EMI Mitigation with Stacking DBC Substrate for High Voltage Power Module
- Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler
- Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
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