Mohammad Dehan Rahman
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Researcher
Also affiliated: University of Arkansas System (2025); European University of Bangladesh (2022); Islamic University of Technology (2018–2022)
Faculty Researcher
Research Areas
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Biography and Research Information
OverviewAI-generated summary
Mohammad Dehan Rahman's research focuses on power electronics, specifically the design and analysis of DC-DC converters and solid-state circuit breakers. His work investigates components for power modules, including research into the impact of low thermal conductivity on gallium oxide power module packaging and the design of low parasitic inductance GaN HEMT flip-chip power modules. Rahman also explores phase change material-based silicon carbide power module packaging and the development of compact models for β-Ga2O3 Schottky barrier diodes. His collaborative efforts include 14 shared publications with Xiaoqing Song and 8 with Abu Shahir Md Khalid Hasan, both at the University of Arkansas at Fayetteville. Rahman has published 31 papers with a total of 89 citations and an h-index of 6.
Metrics
- h-index: 6
- Publications: 31
- Citations: 96
Selected Publications
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Development of Low Inductance Direct Bonded Flipchip Gallium Nitride Module (2026)
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DC Modeling of 8 kV Depletion Mode Gallium Oxide MOSFET (2026)
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Thermal Design and Analysis of Phase Change Material Integrated SiC Based Solid State Circuit Breaker (2026)
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Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions (2026)
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SEU Effect in E-Mode β-Ga <sub>2</sub> О <sub>3</sub> MOSFET with Epitaxial Drift Layer at the Breakdown Region (2025)
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A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules (2025)
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Design and Evaluation of a 650 V, 300 A GaN-Based Power Module with Integrated Drivers and Ultra-Low Inductance Layout (2025)
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DC Partial Discharge Characterization of a Coreless PCB Transformer (2025)
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Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module (2025)
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Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers (2025)
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Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET (2025)
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Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode (2025)
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Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module (2025)
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Serial Peripheral Interface Based Primary Layer Control of a Solid State Transformer (2024)
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A SiC MOSFET Based Multi-Port Solid State Circuit Breaker for DC Protection (2024)
Collaboration Network
Top Collaborators
- A Multi-Port Solid State Circuit Breaker for LVDC Protection: Towards A Lossless Design
- Investigation of the Impact of Low Thermal Conductivity on Gallium Oxide Power Module Packaging
- A SiC MOSFET Based Multi-Port Solid State Circuit Breaker for DC Protection
- Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
- A Review of Power Electronics Converters in Hydrogen Fuel Cell Application
Showing 5 of 15 shared publications
- Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- High Temperature Characterization and Degradation Test of a Cascode Gallium Nitride Field Effect Transistor
- Thermal and Bonding Strength Evaluation of Die Attach Materials for Power Module Packaging
- Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET
Showing 5 of 13 shared publications
- Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- High Temperature Characterization and Degradation Test of a Cascode Gallium Nitride Field Effect Transistor
- Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET
- Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module
Showing 5 of 9 shared publications
- Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices
- Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module
- A Multi-Port Solid State Circuit Breaker for LVDC Protection: Towards A Lossless Design
- A SiC MOSFET Based Multi-Port Solid State Circuit Breaker for DC Protection
- Serial Peripheral Interface Based Primary Layer Control of a Solid State Transformer
- Thermal Design and Analysis of Phase Change Material Integrated SiC Based Solid State Circuit Breaker
- Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- SEU Effect in E-Mode β-Ga <sub>2</sub> О <sub>3</sub> MOSFET with Epitaxial Drift Layer at the Breakdown Region
- DC Modeling of 8 kV Depletion Mode Gallium Oxide MOSFET
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET
- SEU Effect in E-Mode β-Ga <sub>2</sub> О <sub>3</sub> MOSFET with Epitaxial Drift Layer at the Breakdown Region
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Design and Evaluation of a 650 V, 300 A GaN-Based Power Module with Integrated Drivers and Ultra-Low Inductance Layout
- A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers
- Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions
- Design and Evaluation of a 650 V, 300 A GaN-Based Power Module with Integrated Drivers and Ultra-Low Inductance Layout
- A Simplified Gate Driver Architecture for Achieving Fast Switching in Medium-Voltage SiC Power Modules
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