Yuyang Wang
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Graduate Assistant
Also affiliated: Guangxi University (2025); Guizhou University (2021); Chinese Academy of Sciences (2025); University of Warwick (2025); Changchun Institute of Technology (2022); Institute of Semiconductors (2025); Qingdao University of Technology (2023); The University of Texas at Austin (2016); Shanghai Maritime University (2024); Capital Normal University (2024); Nanjing University of Aeronautics and Astronautics (2024); Tsinghua University (2017)
Research Areas
Biomedical Subjects
Links
Biography and Research Information
OverviewAI-generated summary
Yuyang Wang's research has explored diverse areas including power electronics for electric vehicle inverters, urban millimeter wave networks, and consensus-based distributed control for microgrids. Wang has investigated the deformation mechanisms in high-stress soft rock roadways and analyzed urban millimeter wave microcellular networks. Recent work includes the optimal pricing and carbon emission reduction decisions within prefabricated building supply chains under carbon cap-and-trade regulations and government subsidies. Additionally, Wang has examined evolutionary game dynamics between regional governments and shipping companies concerning government subsidies, as well as exploring the integrated development of culture and tourism in the Guangdong, Hong Kong, and Macao Greater Bay Area. Wang's scholarship metrics include an h-index of 5, with 20 total publications and 92 total citations.
Metrics
- h-index: 5
- Publications: 20
- Citations: 92
Positions
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Graduate Assistant 2023–presentUniversity of Arkansas at Fayetteville College of Engineering ORCID
Selected Publications
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Automated Near-Field EMI Scanning System Using Robotic Arm for Wide-Bandgap-Based Power Converters (2026)
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Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules (2025)
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Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices (2024)
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A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters (2024)
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Gate Driver with Dynamic Drive Strength on High-Temperature CMOS Process for Heterogeneous Integration inside the SiC Power Module (2023)
Collaboration Network
Top Collaborators
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- Gate Driver with Dynamic Drive Strength on High-Temperature CMOS Process for Heterogeneous Integration inside the SiC Power Module
- Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules
- Gate Driver with Dynamic Drive Strength on High-Temperature CMOS Process for Heterogeneous Integration inside the SiC Power Module
- Gate Driver with Dynamic Drive Strength on High-Temperature CMOS Process for Heterogeneous Integration inside the SiC Power Module
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters
- Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices
- Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices
- Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices
- Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices
- Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules
- Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules
- Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules
- Fabrication Process Refinement Enabling High-Performance DSC 1.2 kV SiC Power Modules
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