Abu Shahir Md Khalid Hasan
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Graduate Research Assistant
Also affiliated: Louisiana State University Agricultural Center (2021)
Graduate Student Researcher
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Biography and Research Information
OverviewAI-generated summary
Abu Shahir Md Khalid Hasan's research focuses on semiconductor materials and devices, particularly silicon carbide (SiC) and gallium nitride (GaN) technologies for power electronics. His work includes developing and modeling SiC power MOSFETs for harsh environments, investigating their temperature-scaling properties, and creating compact models for SiC power modules. Hasan also explores the performance of gallium oxide (Ga2O3) MOSFETs, including their behavior under single event upsets at breakdown regions. His research extends to the deep cryogenic characterization of GaN HEMTs and the design of low-inductance GaN HEMT power modules. Hasan has authored or co-authored numerous publications in this field and collaborates with researchers at the University of Arkansas at Fayetteville, including Md Maksudul Hossain, Mohammad Dehan Rahman, Muhammad Nazrul Islam, and H. Alan Mantooth.
Metrics
- h-index: 6
- Publications: 24
- Citations: 111
Selected Publications
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Development of Low Inductance Direct Bonded Flipchip Gallium Nitride Module (2026)
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DC Modeling of 8 kV Depletion Mode Gallium Oxide MOSFET (2026)
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A New Simulation Method to Assess Temperature and Radiation Effects on SiC Resonant-Converter Reliability (2026)
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SEU Effect in E-Mode β-Ga <sub>2</sub> О <sub>3</sub> MOSFET with Epitaxial Drift Layer at the Breakdown Region (2025)
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Design and Evaluation of a 650 V, 300 A GaN-Based Power Module with Integrated Drivers and Ultra-Low Inductance Layout (2025)
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Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module (2025)
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Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET (2025)
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Compact Model for a Ferroelectric Capacitor Compatible with Integrated Circuit Design in Harsh Environment (2025)
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Breakdown and C-V Characteristics Analysis of Depletion Mode Lateral β-Ga<sub>2</sub>O<sub>3</sub> MOSFET (2025)
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Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode (2025)
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Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module (2025)
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A 0.8 V Bandgap Voltage Reference with High PSRR for Low-Dropout Voltage Regulator in 22nm FD-SOI (2024)
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High Temperature Characterization and Degradation Test of a Cascode Gallium Nitride Field Effect Transistor (2024)
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Temperature Scaling and <i>C–V</i> Modeling of SiC Low-Voltage MOSFETs for IC Design (2024)
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Impact of 6.5-kV SiC MOSFET Gate Bias on Reverse Recovery Over a Wide Temperature Range (2024)
Collaboration Network
Top Collaborators
- A review of silicon carbide CMOS technology for harsh environments
- 3.3 kV Low-Inductance Full SiC Power Module
- A Physics-based Simscape Compact SiC Power MOSFET Model with Temperature-Scaling
- Single Event Upset in Depletion-Mode Gallium Oxide MOSFETs at the Breakdown Region
- Temperature Scaling and <i>C–V</i> Modeling of SiC Low-Voltage MOSFETs for IC Design
Showing 5 of 17 shared publications
- A Physics-based Simscape Compact SiC Power MOSFET Model with Temperature-Scaling
- Single Event Upset in Depletion-Mode Gallium Oxide MOSFETs at the Breakdown Region
- Temperature Scaling and <i>C–V</i> Modeling of SiC Low-Voltage MOSFETs for IC Design
- Deep Cryogenic Characterization of GaN HEMT at 4K
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
Showing 5 of 8 shared publications
- Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- High Temperature Characterization and Degradation Test of a Cascode Gallium Nitride Field Effect Transistor
- Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET
- Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module
Showing 5 of 8 shared publications
- Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- High Temperature Characterization and Degradation Test of a Cascode Gallium Nitride Field Effect Transistor
- Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET
- Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- Breakdown and C-V Characteristics Analysis of Depletion Mode Lateral β-Ga<sub>2</sub>O<sub>3</sub> MOSFET
- Compact Model for a Ferroelectric Capacitor Compatible with Integrated Circuit Design in Harsh Environment
- SEU Effect in E-Mode β-Ga <sub>2</sub> О <sub>3</sub> MOSFET with Epitaxial Drift Layer at the Breakdown Region
- DC Modeling of 8 kV Depletion Mode Gallium Oxide MOSFET
- Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
- Compact Model of β-Ga<sub>2</sub>O<sub>3</sub> Schottky Barrier Diode
- Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module
- 3.3 kV Low-Inductance Full SiC Power Module
- Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module
- 3.3 kV Low-Inductance Full SiC Power Module
- Impact of 6.5-kV SiC MOSFET Gate Bias on Reverse Recovery Over a Wide Temperature Range
- 3.3 kV Low-Inductance Full SiC Power Module
- Impact of 6.5-kV SiC MOSFET Gate Bias on Reverse Recovery Over a Wide Temperature Range
- 3.3 kV Low-Inductance Full SiC Power Module
- Impact of 6.5-kV SiC MOSFET Gate Bias on Reverse Recovery Over a Wide Temperature Range
- A 0.8 V Bandgap Voltage Reference with High PSRR for Low-Dropout Voltage Regulator in 22nm FD-SOI
- Threshold Voltage Extraction Method for Low-Voltage SiC MOSFETs at High-Temperature
- A 0.8 V Bandgap Voltage Reference with High PSRR for Low-Dropout Voltage Regulator in 22nm FD-SOI
- Threshold Voltage Extraction Method for Low-Voltage SiC MOSFETs at High-Temperature
- A review of silicon carbide CMOS technology for harsh environments
- A New Simulation Method to Assess Temperature and Radiation Effects on SiC Resonant-Converter Reliability
- A review of silicon carbide CMOS technology for harsh environments
- A New Simulation Method to Assess Temperature and Radiation Effects on SiC Resonant-Converter Reliability
- Compact Model for a Ferroelectric Capacitor Compatible with Integrated Circuit Design in Harsh Environment
- Compact Modeling of <i>β</i> -Ga <sub>2</sub> O <sub>3</sub> Lateral Depletion Mode MOSFET
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