Kevin Chen Data-verified

Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.

High Impact

Research Assistant Professor

Last publication 2025 Last refreshed 2026-05-16

faculty

31 h-index 125 pubs 12,680 cited

Biography and Research Information

OverviewAI-generated summary

Kevin Chen's research focuses on semiconductor materials and devices, with a particular emphasis on silicon carbide (SiC) technology for high-temperature applications and harsh environments. His work includes the fabrication and characterization of SiC Schottky barrier diodes with temperature-sensitive properties and investigating the high-temperature reliability of Ti-based ohmic contacts to SiC.

Beyond semiconductor research, Chen has also contributed to studies in other areas. These include the development of low-power wireless EEG recorders for long-term mental health monitoring, high-density protein arrays for proteomic studies, and laboratory-scale equipment for characterizing granular materials. His publications also touch upon circular agriculture for sustainable development and the design of continuum mechanisms.

Chen holds a significant academic record, with an h-index of 31, over 125 publications, and more than 12,680 citations. He is recognized as a highly cited researcher and collaborates with several colleagues at the University of Arkansas at Fayetteville, including K. Chen, Pengyu Lai, Anthony Di Mauro, and Hui Wang.

Metrics

  • h-index: 31
  • Publications: 125
  • Citations: 12,680

Selected Publications

  • Fabrication and Characterization of 4H-SiC Schottky Barrier Diodes with Highly Linear Temperature Sensitivity (2025)
  • Thermal Analysis and Modeling of Gallium Oxide Diode-based Half Bridge Power Module (2025)
  • Compact Busbar Design Strategy for a 100 kW, 300 kHz Dual Active Bridge Converter Topology (2025)
  • Heterogeneously Integrated 3.3 kV SiC MOSFET Power Module with Multi-layer Substrate and Built-in Gate Drivers (2025)
  • <i>(Invited)</i> High-Temperature Reliability of Ti-Based Ohmic Contacts to SiC (2025)
  • Evaluation of Heat Spreading Technologies Within Double-Side-Cooled Power Modules (2025)
  • Use of E-Beam Lithography to Optimize Lithography Patterning on SiC Wafers (2025)
    1 citation DOI OpenAlex
  • Design Optimizations of Micrometer SiC CMOS Devices for High-Temperature IC Applications (2025)
  • Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability (2025)
    39 citations DOI OpenAlex
  • Multiobjective Optimization and Enhanced Design of an Ω-Shaped Current Sensor for WBG Devices (2025)
    1 citation DOI OpenAlex
  • Design and Characterization of 1.2 kV Optically Isolated Half-Bridge Modules for High Temperature Operation (2024)
    1 citation DOI OpenAlex
  • Multi-tier Cooling Solution for 10 kV SiC MOSFET Power Module Featuring Stacked Substrates (2024)
  • Optimal Point Derive for SiC MOSFET Switching Ringing Damping with Active Gate Driver Control (2024)
  • Evaluation of the Bonding Strength of Die Attachment Techniques for Gallium Oxide Power Devices (2024)
  • A 10 kV SiC MOSFET Power Module With Optimized System Interface and Electric Field Distribution (2024)
    34 citations DOI OpenAlex

View all publications on OpenAlex →

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